BridgeComm Advances Ultra High-Throughput Connectivity With MOCA Technology
September 23, 2020 | Business WireEstimated reading time: Less than a minute
BridgeComm, Inc., a leader in optical wireless communications (OWC) solutions and services, announced significant achievements in the advancement of OWC with the on going maturity of its Managed Optical Communication Array (MOCA) hardware and software technology. Validated by a partnership with an independent third party, MOCA technology allows for multi-domain capabilities to share large volumes of data and collaborate significantly faster with increased security.
BridgeComm’s MOCA technology enables a point-to-multipoint laser communications solution with a rapidly steerable system that achieves multi-target transmit and receive connections, while significantly reducing the size, weight and power of traditional tracking OWC terminals. The technology is modular and scalable, allowing for rapid development and implementation of terminals suitable for space, air, land and sea domains.
“All the significant functionalities needed for point-to-multipoint and fully meshed communications have been realized in this design,” said BridgeComm CEO Barry Matsumori. “When considering tactical and strategic applications, the features of our MOCA-based terminals provide several key features for multiple simultaneous connections, comms-on-the-move, and networking across platforms with unparalleled security, unlocking point-to-multipoint capability for optical networks.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).