Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
BridgeComm Advances Ultra High-Throughput Connectivity With MOCA Technology
September 23, 2020 | Business WireEstimated reading time: Less than a minute
BridgeComm, Inc., a leader in optical wireless communications (OWC) solutions and services, announced significant achievements in the advancement of OWC with the on going maturity of its Managed Optical Communication Array (MOCA) hardware and software technology. Validated by a partnership with an independent third party, MOCA technology allows for multi-domain capabilities to share large volumes of data and collaborate significantly faster with increased security.
BridgeComm’s MOCA technology enables a point-to-multipoint laser communications solution with a rapidly steerable system that achieves multi-target transmit and receive connections, while significantly reducing the size, weight and power of traditional tracking OWC terminals. The technology is modular and scalable, allowing for rapid development and implementation of terminals suitable for space, air, land and sea domains.
“All the significant functionalities needed for point-to-multipoint and fully meshed communications have been realized in this design,” said BridgeComm CEO Barry Matsumori. “When considering tactical and strategic applications, the features of our MOCA-based terminals provide several key features for multiple simultaneous connections, comms-on-the-move, and networking across platforms with unparalleled security, unlocking point-to-multipoint capability for optical networks.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.