-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
BridgeComm Advances Ultra High-Throughput Connectivity With MOCA Technology
September 23, 2020 | Business WireEstimated reading time: Less than a minute
BridgeComm, Inc., a leader in optical wireless communications (OWC) solutions and services, announced significant achievements in the advancement of OWC with the on going maturity of its Managed Optical Communication Array (MOCA) hardware and software technology. Validated by a partnership with an independent third party, MOCA technology allows for multi-domain capabilities to share large volumes of data and collaborate significantly faster with increased security.
BridgeComm’s MOCA technology enables a point-to-multipoint laser communications solution with a rapidly steerable system that achieves multi-target transmit and receive connections, while significantly reducing the size, weight and power of traditional tracking OWC terminals. The technology is modular and scalable, allowing for rapid development and implementation of terminals suitable for space, air, land and sea domains.
“All the significant functionalities needed for point-to-multipoint and fully meshed communications have been realized in this design,” said BridgeComm CEO Barry Matsumori. “When considering tactical and strategic applications, the features of our MOCA-based terminals provide several key features for multiple simultaneous connections, comms-on-the-move, and networking across platforms with unparalleled security, unlocking point-to-multipoint capability for optical networks.”
Suggested Items
Siemens Launches New Program to Empower Startups with Cutting-edge Technology
01/07/2025 | SiemensSiemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
01/07/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.
Fein-Lines: CES 2025—The Consumer Technology Association's Super Event
01/07/2025 | Dan Feinberg -- Column: Fein-LinesThe Consumer Electronics Show, better known simply as CES 2025, starts today, Jan. 7, and continues to Jan. 10 in Las Vegas with an expected attendance of 150,000 tech enthusiasts and innovators. This highly anticipated annual show is a preview of the amazing technology advancements and devices we can expect to see over the next few years.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability
Trane Technologies Completes Acquisition of BrainBox AI
01/03/2025 | BUSINESS WIRETrane Technologies, a global climate innovator, announced that it has completed the acquisition of BrainBox AI, a pioneer in autonomous HVAC controls and generative Artificial Intelligence (AI) building technology. The acquisition was previously announced in a press release on December 18, 2024.