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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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INEMI Announces Board of Directors Election Results
April 16, 2025 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.
New to the INEMI Board is Tadashi Kosuga, Executive Director and Distinguished Engineer, Commercial Subsystem Development, Lenovo. Returning incumbents include Ravi M. Bhatkal, Managing Director and General Manager for MacDermid Alpha Electronics Solutions; Ranjan Chatterjee, Vice President, Smart Manufacturing Solutions, PDF/SOLUTIONS; Andy Mackie, Principal Engineer and Manager, Thermal Interface Materials Applications for Indium Corporation; and Chris Rumer, Vice President, Foundry Technology Development and Director, Chandler Assembly Technology Development, Intel Corporation.
“In addition to overseeing business operations and general affairs, our Board members play a very important role in guiding INEMI, helping us focus on issues of importance to the industry, and making sure we maximize value to our member companies,” says INEMI CEO Shekhar Chandrashekhar. “We have a strong group of directors who represent the breadth of the electronics manufacturing supply chain, and they provide the knowledge and expertise to help make INEMI a success. Congratulations to our recently elected Directors. We look forward to working with you.”
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Brent Fischthal - Koh YoungSuggested Items
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
08/26/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates
06/18/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.
Webinar: INEMI Printed Circuit Board Roadmap
06/13/2025 | iNEMIJoin INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
06/09/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.