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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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INEMI Announces Board of Directors Election Results
April 16, 2025 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.
New to the INEMI Board is Tadashi Kosuga, Executive Director and Distinguished Engineer, Commercial Subsystem Development, Lenovo. Returning incumbents include Ravi M. Bhatkal, Managing Director and General Manager for MacDermid Alpha Electronics Solutions; Ranjan Chatterjee, Vice President, Smart Manufacturing Solutions, PDF/SOLUTIONS; Andy Mackie, Principal Engineer and Manager, Thermal Interface Materials Applications for Indium Corporation; and Chris Rumer, Vice President, Foundry Technology Development and Director, Chandler Assembly Technology Development, Intel Corporation.
“In addition to overseeing business operations and general affairs, our Board members play a very important role in guiding INEMI, helping us focus on issues of importance to the industry, and making sure we maximize value to our member companies,” says INEMI CEO Shekhar Chandrashekhar. “We have a strong group of directors who represent the breadth of the electronics manufacturing supply chain, and they provide the knowledge and expertise to help make INEMI a success. Congratulations to our recently elected Directors. We look forward to working with you.”
Suggested Items
INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates
06/18/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.
Webinar: INEMI Printed Circuit Board Roadmap
06/13/2025 | iNEMIJoin INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany.
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INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.
iNEMI Hosts Two Sessions at IPC APEX EXPO, Focus on Roadmap for PCB, Assembly, and Laminates
02/26/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) will have two forward-looking sessions at the upcoming IPC APEX EXPO in Anaheim, California (March 18-20). Both sessions are open to conference attendees with a (free) Event Essentials Pass. The two sessions are outlined below.