The New Chapter: The Benefits of Continuing Education
It’s Only Common Sense: You’ve Got to Hustle
Nanotech Energy Launches EMI Shielding Product Line
October 6, 2020 | PR NewswireEstimated reading time: 2 minutes
Nanotech Energy Inc., a leading manufacturer of graphene, announces the debut of Nanotech EMI Armour Paint & Sheets, graphene powered coatings and films for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding, as well as heat management. The EMI Shielding line currently contains six products – all of which are highly conductive and provide excellent external EMI/RFI protection while also preventing internal EMI/RFI leaks. The products can be sprayed, brushed, rolled or dip-coated onto various surfaces, such as glass, plastic and metal – depending on the specific product used.
Eco EMI Armour Paint
The Nanotech EMI shielding product line is based on the Company's premium graphene technology and consists of the following:
- Eco Armour Paint & Sheets: A one-part, aqueous conductive paint, designed to attenuate EMI/RFI and dissipate heat for heat management. This product features graphene-based carbon composite that provides significant weight reduction, corrosion protection and reduced cost, while achieving the required protection for the Gigahertz frequency range.
- Elite Armour Paint: A two-part polyurethane conductive paint, with silver-coated copper flakes, that provides the highest attenuation, especially when thin profiles/coatings are required.
- Elite Armour Sheets: A thin, flexible, scratch resistant and lightweight conductive sheet offering superior EMI shielding properties, along with excellent thermal conductivity, mechanical flexibility and structural integrity.
- Ultra Elite Armour Paint & Sheets: have the attributes mirroring Elite Paint and Sheets mentioned above, but with a polyester binder that provides exceptional flexibility. Ultra Elite paint is a one-part spray, that offers processing advantages, along with the ability to coat enclosures with complex geometry. Ultra Elite Sheets are offered in various sizes.
Electromagnetic shielding prevents electromagnetic waves from impacting sensitive electronics – everything from televisions and microwaves to mobile phones and baby monitors, along with the critical computer processors in today's smart devices. Traditionally this has been achieved through metallic screens or metal enclosures built within the devices. Painting the shielding ensures a more thorough coverage with the potential of a reduced manufacturing cost. In addition, Nanotech EMI shielding products can also dissipate the heat away from sensitive electronic devices, allowing the regulation of their temperature and preventing thermal shutdown of modern electronics.
"Nanotech's EMI Armour products are critical to ensure the effectiveness and safety of today's electronics," stated Dr. Jack Kavanaugh, chairman and CEO of Nanotech Energy Inc. "As technology advances and more is demanded of sophisticated and sensitive parts, EMI shielding allows for complete sealing and ultimately making electronic devices safer for consumers."
"Nowadays, humans rely on electronics more than ever before. While electronic devices bring great convenience to our lives, they also bring potential harm and a new form of environmental pollution. We have developed products that can block more than 99.9999% of the electromagnetic waves at a fraction of the weight of traditional materials," stated Dr. Maher El-Kady, co-founder and Chief Technology Officer of Nanotech Energy.
Graphene is the thinnest, strongest and most flexible material known. It is 200 times stronger than steel, 97% transparent, extremely light in weight, flexible and stretchable. These fascinating properties helped us develop EMI products with a shielding level of at least 60-80 dB for sheets and spray paints. All products were tested in compliance with IEEE Std. 299-2006 and MIL-STD-285 and have been independently confirmed by a third party.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.