-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Shengyi Technology Releases Ultra-Low Loss PCB Substrate
October 15, 2020 | Shengyi TechnologyEstimated reading time: 1 minute
Shengyi Technology Co., Ltd. has developed a PTFE based Ultra-Low Insertion loss controlled dielectric printed circuit board laminate called mmWave77 and will officially launch this product on Oct. 16, 2020.
SYTECH mmWave77 laminate material exhibits excellent electrical properties with stability over frequency, temperature and environmental changes that provides for long term reliability.
SYTECH mmWave77 Laminate Material Features:
- Process Dk is 3.0 +/-0.04, Df 0.0010 @10GHz (stripline method)- mmWave77’s Design Dk is 3.06 and Insertion Loss is - 1.29 dB/in @77GHz, based on 0.127mm (5mil) dielectric thickness, 12mil line width and H/H foil. mmWave77 electrical properties have been designed to align with the industry leading laminate of choice for 77GHz ADAS radars.
- Dielectric constant (Dk) is stable between -40? and +150? at up to V-band frequency. Temperature Coefficient of Dk (TcDk) is between -12 and -20 ppm/? (-40?~+150?).
- Dielectric thickness tolerance is 0.127 +/- 0.006 mm (5mil +/- 5%).
- Ceramic filled PTFE composition provides industry’s lowest transmission loss, resulting in the highest transmission efficiency for mission critical automotive safety radars.
- The construction of mmWave77 non-reinforced PTFE with ceramic fillers exhibits homogeneous in uniformity in all three directions.
- Low moisture absorption and environmentally stable.
- Process friendly. mmWave77 is constructed to minimize process chemical penetration and is laser ablation compatible. It is suitable to build mixed dielectrics boards.
- High thermal reliability passing strict solder float (288?, 6X), thermal cycling tests (-65? to +125?, 500 cycles) and IST (23? to 150?, 1000 cycles).
SYTECH mmWave77 is designed, constructed and manufactured to meet the demanding electrical performance as well as reliability and safety requirements of 77GHz automotive radars. This new generation of product is an ideal cost-effective replacement to the mainstream PTFE laminate of choice of ADAS radar designs. SYTECH material provides an exceptional overall value proposition relative to overall cost with an emphasis on quality, product consistency and product availability.
SYTECH possess in house advanced test capability platform to measure the electrical performance of controlled dielectric materials up to 110GHz for both R&D and quality consistency lot to lot material monitoring. With greater than 16 years experience dedicated in supplying electronic materials to the automotive industry SYTECH management is committed to state-of-the-art process, quality control and overall continuous improvement systems and concepts. SYTECH corporation qualified for ISO/TS16949 (2004) and recently updated to IATF 16949 (2018).
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.