Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Mek Launches Fast, Simple PCB Conformal Coating Inspection
October 21, 2020 | Mek (Marantz Electronics)Estimated reading time: 1 minute
Mek (Marantz Electronics), leading supplier of 3D Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technologies, has launched the iSpector JUz for conformal coating inspection.
Based on proven Mek AOI technology, the iSpector JUz automates the conformal coating inspection process to ensure coating quality and consistency.
Conformal coating inspection, (CCI) is an essential stage of the conformal coating process and yet one that very few companies undertake, aside from a brief manual visual inspection. But manual inspection is an extremely difficult job due to factors such as eye strain and concentration drift, while slow throughput makes it economically challenging.
Mek automated iSpector JUz CCI systems for automatic inspection of conformal coatings and defect detection see more than an operator ever could and make conformal coat inspection fast, simple and cost efficient.
Most Conformal Coating includes a UV florescent dye, typically in the 365 to 405nm range. UV light causes the coating to fluoresce which highlights discrepancies, contamination or process issues. Used after manual spray, automatic spray and dip coating applications, the system inspects the PCB and components and identifies coating issues including missing coating, bubbles, insufficient thickness, voids, coating in areas where not wanted and other common contaminations.
Unique algorithms and dedicated strategies allow easy and fast programming with high detection coverage. A comprehensive and easy to use online training suite is available via the Mek iMentor online training system.
The iSpector JUz is available as Desktop, Inline and also on the modular SpectorBOX system.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.