Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
Henkel, Nexa3D Launch Affordable, Ultra-fast xPRO410
October 29, 2020 | HenkelEstimated reading time: 1 minute
Nexa3D, the maker of ultrafast stereolithography production 3D printers, and Henkel, a leading supplier of high impact functional additive materials, announced that they are taking another decisive step in their expanding collaboration aimed at democratizing access to a new class of photopolymers with the introduction of the xPRO410, a rigid photoplastic that prints extremely high accuracy parts with exceptional surface finish. Formulated based on Henkel’s Loctite PRO410 polymer and optimized for the Nexa3D’s NXE400 3D printer, this material is ideal for general purpose prototyping.
xPRO410 is an affordable general-purpose material enabling multiple daily design iterations and same day on-demand parts for small and large product enterprises. This rigid material offers extremely high accuracy and exceptional surface finish that is ideal for service bureaus seeking to upgrade their services to same day and next day fulfilment. It enables the fast and accurate printing of parts for a wide range of form, fit and function designs and beautiful appearance prototypes. xPRO410 can be printed continuously on the NXE400 at speeds of up to 8 liters per hour, representing a 20x productivity gain. xPRO410 parts achieve dimensional accuracy of within 0.2% after post curing on the Nexa3D xCure system and can withstand temperature exposure of up to 70°C.
Nexa3D plans to include xPRO410 with every NXE400 it sells commercially as of November 1st, 2020. To learn more about the expanding Henkel and Nexa3D partnership, check out this media kit and watch this video or visit Nexa3D’s virtual booth located on FormNext Connect. You can get your free pass here.
"We are excited to further expand our partnership with Nexa3D and provide market access to a new class of photopolymers just in time for FormNext Connect," said Ken Kisner, Head of Innovation at Henkel. “These next steps in our collaboration with Nexa3D are casting a new light on additive polymers and shattering traditional 3D printing productivity, performance and cost barriers.”
“It’s very gratifying for me to witness how quickly our partnership with Henkel is yielding transformative industry outcomes,” said Avi Reichental, co-founder, chairman and CEO Nexa3D. “Every product company knows that to produce great products they need brilliant designers and innovative tools. With the launch of xPRO410 Henkel and Nexa3D are making design iteration possible in minutes instead of days or weeks and that is a truly gamechanger.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
10/07/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignFor years, Midwest PCB manufacturing was often viewed as a low-cost, high-volume business—good for standard builds but not for the high-reliability programs that demand tight process control. Defense primes and medical OEMs frequently turned to coastal or overseas suppliers for advanced work.