-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP, mSAP
November 2, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
As the demands for electronic devices grow increasingly complex with new mobile and infrastructure applications in the 5G rollout, both the circuit board and IC substrate continue to grow in component and circuit density. The CircuEtch 200 anisotropic final etch is the latest addition to the MacDermid Alpha process family for the manufacturing of the advanced HDI utilized in these new applications. In the additive build-up process utilized in mSAP and SAP, the final etch that is used to define the fine line features of the layer must be an extremely stable process with a wide operating window to allow for extremely low defect rates. CircuEtch 200 precisely defines traces with optimal geometry, zero undercut, and vertical trace sidewalls for excellent electrical performance. The bath has a predictable etching rate over a wide range of additive, copper, acid, chloride concentration and operating temperatures, while running in easy to maintain horizontal spray etching equipment. The high-speed etching of CircuEtch 200 can remove up to 5 microns of electrodeposited copper foil or electroless copper seed layer per minute while reducing the surface roughness of the pattern plated electrolytic copper traces for improved surface properties.
“The release of CircuEtch 200 enables our customers to run their entire SAP and mSAP with MacDermid Alpha chemical process solutions, leveraging cross-process improvements that increase yields and product quality while reducing costs. We are very excited to bring the high-performance etching of CircuEtch 200 to the advanced substrate markets to create the finest lines and spaces utilized on organic PCBs today.” – Rich Retallick, Director of Electronics Specialties, Circuitry Solutions.
For more information on CircuEtch 200, please visit MacDermidAlpha.com
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Suggested Items
DuPont Announces Additional Directors for the Planned Independent Electronics Company
04/18/2025 | DuPontDuPont announced that Karin De Bondt and Anne Noonan will become members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont, which is targeted for November 1, 2025.
Navigating Robotics Deployment Challenges with SINBON
04/18/2025 | PRNewswireIn spite of the potential for robotics technology to expand productivity, several implementation challenges continue to stand in the way of more widespread adoption.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.