Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Insulectro to Host OEM Forum ‘Accelerate Development With Accurate Design Data’
November 2, 2020 | InsulectroEstimated reading time: 1 minute
Insulectro, the largest distributor of materials for use in the printed circuit board and printed electronics industries, will host an OEM FORUM on Thursday, November 5, at 11:05 am Pacific. The topic is “Accelerate Development with Accurate Design Data.”
Join this 45 minute (or so) session to learn how timely PCB fabrication and assembly can maximize reliability and yield. The session is hosted by veteran technical account manager Ron Murdock and will feature Insulectro co-panelists Mike Creeden and Chris Hunrath.
An immensely popular team, Creeden (CID+ MIT and Technology Director for Design Education) will present the design argument while Vice President of Technology Chris Hunrath CID+ will reinforce with material science perspectives. Hunrath and Creeden have been teaming up for several recent webinars and lunch’n’learns gaining enthusiastic responses. They are Better Together!
This Forum should be of particular interest to OEMs, engineers, and designers looking for superior results from PCB materials. Registration is required to join the sessions and attendees will need to access the Zoom application or website to participate.
The forum will be conducted on the Zoom teleconferencing platform and registration can accessed here.
Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC® Inc., Pacothane, Focus Tech Chemicals, JX Nippon, TADCO, EMD Performance Materials, Shikoku, Shur-loc, Kemmer Praezision GmbH, Industrial Brush Corp, and Denkai America. These products are used by Insulectro customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.
Share on:
Suggested Items
Quest Global Acquires Alpha-Numero Technology Solutions
03/14/2025 | Quest GlobalQuest Global is pleased to announce the acquisition of Alpha-Numero Technology Solutions. Alpha-Numero is a US-based VLSI design company with expertise in FPGA.
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.