Just Ask Tara Dunn: What’s Next for LCP Materials?
November 5, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”
Q: Will the surge in liquid crystal polymer use for cellphone antennas “trickle down” and allow LCP to be used more often as a conventional flex substrate?
A: That is a great question. I am certainly seeing an increase in conversations about LCP materials and their benefits not only in cellphone antenna applications but also in medical applications requiring biocompatibility. As with anything cellphone related, there will be a handful of fabricators that use the materials in high volume and over time that trickles through the supply chain. In the case of LCP materials, the fact that there are specialized fabrication parameters that manufacturers need to employ when processing LCP and that the conventional flex substrate market is robust leads me to believe that while we will see an increase in demand for LCP, the material likely won’t displace polymide as the mainstream flex substrate.
To submit your questions for Tara, click here.
Suggested Items
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
Queen's University Belfast Enhances RF Research with LPKF ProtoLaser R4
03/26/2025 | LPKFThe Centre for Wireless Innovation (CWI) at Queen's University Belfast relies on the state-of-the-art LPKF ProtoLaser R4 to conduct RF research with high-precision structuring of sensitive materials.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
03/27/2025 | Jerome Larez -- Column: Global PCB ConnectionsAs a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.