Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
PAS Global to be Acquired by Hexagon AB
November 5, 2020 | PR NewswireEstimated reading time: 1 minute
PAS Global, LLC (PAS), the OT Integrity company, announced it has agreed to be acquired by Hexagon AB (Hexagon), a global leader in sensor, software, and autonomous solutions.
With the combination of PAS and Hexagon, customers will benefit from a comprehensive software portfolio to manage the industrial lifecycle from plant design and maintenance, to real-time situation awareness in the control room, cybersecurity risk management, and industrial digital transformation. PAS also complements and significantly extends Hexagon's global customer footprint in the process industries.
"Since 1993, PAS has delivered solutions that help industrial organizations improve process safety and profitability," said PAS Founder and CEO Eddie Habibi. "As cyber risk in the industrial sector has grown, we have remained true to our mission by expanding our capabilities to further protect operational technology (OT) and have been recognized as a leading cyber asset management company. Now, PAS and Hexagon together will be a powerhouse solution provider for managing the entire industrial lifecycle."
"Hexagon is committed to a mission of empowering the autonomous future by putting data to work to boost efficiency, productivity, and quality across industrial, manufacturing, infrastructure, safety, and mobility applications," said Hexagon PPM President Mattias Stenberg. "The strategic acquisition of PAS will expand our owner operator market presence and broaden our capabilities by extending Hexagon solutions to operational risk management and operational technology cybersecurity."
"We have long admired Hexagon's technology portfolio and team," Habibi added. "There is strong technology and cultural fit across our two organizations, and we are excited to join forces with Hexagon to deliver more value to customers and empower the autonomous future."
The acquisition represents a new cybersecurity-focused business segment within Hexagon's PPM division, which will also provide opportunities with other Hexagon divisions. The process safety solutions brought to Hexagon from PAS will be integrated into the PPM owner operator line of business.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.