Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Cadence Achieves ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP
November 9, 2020 | Business WireEstimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification. The ISO 26262:2018 functional safety standard’s ASIL B(D) certification is essential for the development of automotive systems-on-chip (SoCs) used in autonomous driving and advanced driver assistance systems (ADAS) applications.
The ASIL B(D) certification includes support for both random hardware faults (ASIL B) and systematic faults (ASIL D). This certification is based on SGS-TÜV Saar’s comprehensive audit and assessment of the functional safety development flow in accordance with the ISO 26262:2018 standard and can be found on the SGS-TÜV website.
“Cadence Tensilica ConnX B10 and B20 DSPs are the first DSPs optimized for radar, lidar and V2X applications to achieve Functional Safety Processor full compliance based on SGS-TÜV Saar’s comprehensive assessment in accordance with the ISO26262:2018 standard,” said Wolfgang Ruf, head of Functional Safety for Semiconductors at SGS-TÜV Saar. “Certification of the Cadence Tensilica ConnX B10 and B20 DSPs for ASIL D systematic and ASIL B random compliance attests to the high functional safety quality of their DSP IP, which meets stringent automotive industry safety-critical requirements. SoC designers can have peace of mind that their designs can achieve compliance when using functional safety-certified Tensilica DSP IP.”
Tensilica ConnX DSPs are widely used for building entry-level to high-performance sensors and communication ICs for automotive applications. These DSPs support various data types (8b, 16b, 32b and 64b) and IEEE 754 floating-point precisions, including half, single and double precision. Application-specific accelerations are designed in to boost radar, lidar and/or communication processing performance. The Tensilica Instruction Extension (TIE) language further boosts performance for the designer’s specific algorithm and applications. With a common instruction-set architecture (ISA) and consistent programming model, Tensilica DSPs help protect a customer’s software investment by providing a high degree of software portability and reusability.
“Ensuring coverage for random hardware faults and systematic faults is mandatory for development of ISO 26262-compliant SoCs,” said Larry Przywara, senior group director, Tensilica marketing at Cadence. “Processing requirements for ADAS and autonomous vehicles continue to escalate to support more sophisticated radar, lidar and V2X functions. The industry-first ASIL B(D) certification of the Tensilica ConnX B10 and B20 DSPs designed for these functions enables designers to develop performance-leading ISO 26262-compliant automotive SoCs. In addition, the Tensilica Vision Q7 DSP for vision and AI applications has also received ASIL B (D) compliance certification.”
Tensilica ConnX DSPs support Cadence’s Intelligent System Design™ strategy, enabling SoC design excellence.
Share on:
Suggested Items
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.
ZenaTech’s ZenaDrone Tests Proprietary Camera Enabling IQ Nano Drone Swarms for US Defense Applications, Blue UAS Submission
05/09/2025 | Globe NewswireZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), enterprise SaaS, and Quantum Computing solutions, announces that its subsidiary ZenaDrone is testing a new proprietary specialized camera that enables more efficient indoor applications such as inventory and security management, when utilizing IQ Nano drone swarms for commercial and US defense applications.
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma ElectronicElma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).