-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
NVIDIA, Ampere Computing Raise Arm 26x in Supercomputing
November 18, 2020 | NVIDIA NewsroomEstimated reading time: 3 minutes
In the past 18 months, researchers have witnessed a whopping 25.5x performance boost for Arm-based platforms in high performance computing, thanks to the combined efforts of the Arm and NVIDIA ecosystems.
Many engineers deserve a round of applause for the gains.
- The Arm Neoverse N1 core gave systems-on-a-chip like Ampere Computing’s Altra an estimated 2.3x improvement over last year’s designs.
- NVIDIA’s A100 Tensor Core GPUs delivered its largest ever gains in a single generation.
- The latest platforms upshifted to more and faster cores, input/output lanes and memory.
- And application developers tuned their software with many new optimizations.
As a result, NVIDIA’s Arm-based reference design for HPC, with two Ampere Altra SoCs and two A100 GPUs, just delivered 25.5x the muscle of the dual-SoC servers researchers were using in June 2019. Our GPU-accelerated, Arm-based reference platform alone saw a 2.5x performance gain in 12 months.
The results span applications — including GROMACS, LAMMPS, MILC, NAMD and Quantum Espresso — that are key to work like drug discovery, a top priority during the pandemic. These and many other applications ready to run on Arm-based systems are available in containers on NGC, our hub for GPU-accelerated software.
Companies and researchers pushing the limits in areas such as molecular dynamics and quantum chemistry can harness these apps to drive advances not only in basic science but in fields such as healthcare.
Under the Hood with Arm and HPC
The latest reference architecture marries the energy-efficient throughput of Ampere Computing’s Mt. Jade, a 2U-sized server platform, with NVIDIA’s HGX A100 that’s already accelerating several supercomputers around the world. It’s the successor to a design that debuted last year based on the Marvell ThunderX2 and NVIDIA V100 GPUs.
Mt. Jade consists of two Ampere Altra SoCs packing 80 cores each based on the Arm Neoverse N1 core, all running at up to 3 GHz. They provide a whopping 192 PCI Express Gen4 lanes and up to 8TB of memory to feed two A100 GPUs.
The combination creates a compelling node for next-generation supercomputers. Ampere Computing has already attracted support from nine original equipment and design manufacturers and systems integrators, including Gigabyte, Lenovo and Wiwynn.
A Rising Arm HPC Ecosystem
In another sign of an expanding ecosystem, the Arm HPC User Group hosted a virtual event ahead of SC20 with more than three dozen talks from organizations including AWS, Hewlett Packard Enterprise, the Juelich Supercomputing Center, RIKEN in Japan, and Oak Ridge and Sandia National Labs in the U.S. Most of the talks are available on its YouTube channel.
In June, Arm made its biggest splash in supercomputing to date. That’s when the Fugaku system in Japan debuted at No. 1 on the TOP500 list of the world’s fastest supercomputers with a stunning 415.5 petaflops using the Arm-based A64FX CPU from Fujitsu.
At the time it was one of four Arm-powered supercomputers on the list, and the first using Arm’s Scalable Vector Extensions, technology embedded in Arm’s next-generation Neoverse designs that NVIDIA will support in its software.
Meanwhile, AWS is already running in the cloud HPC jobs like genomics, financial risk modeling and computational fluid dynamics on its Arm-based Graviton2 processors.
NVIDIA Accelerates Arm in HPC
Arm’s growing HPC presence is part of a broad ecosystem of 13 million developers in areas that span smartphones to supercomputers. It’s a community NVIDIA aims to expand with our deal to acquire Arm to create the world’s premier company for the age of AI.
We’re extending the ecosystem with Arm support built into our NVIDIA AI, HPC, networking and graphics software. At last year’s supercomputing event, NVIDIA CEO Jensen Huang announced our work accelerating Arm in HPC in addition to our ongoing support for IBM POWER and x86 architectures.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Technica USA Partners with Creative Electron
10/22/2025 | Technica USATechnica USA is proud to announce the partnership with Creative Electron Inc. located in San Marcos, CA.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).