-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
Article Highlights
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Happy’s Essential Skills: Recruiting and Interviewing
December 29, 2020 | Happy Holden, I-Connect007Estimated reading time: 2 minutes
Editor’s note: This article was originally published online in 2016 and has since been updated.
Hopefully, your career has progressed to the point that you are empowered to recruit your own team or a key person for your team. There are always technical people looking for better jobs, but many times, the most talented are busy doing their work and not looking for new opportunities. If you are fortunate enough to work for a company that has established a stellar reputation, the job of recruiting becomes a lot easier. This was what I found after working a few years for Hewlett-Packard.
Recruiting
As a result of our rapid expansion and automation due to the phenomenal sales of the HP-35 scientific calculator, I was promoted to process engineering manager. I needed to recruit more printed circuit process engineers. HP had a unique method of distributing engineering resources. It was a kind of free-market method for the workforce. Management would approve 10 times as many “internal hire only,” as they would “authorized for external hire” and “relocation authorized.”
What this meant was that there was always a lot of competition for the most talented engineers in the company, as they could easily transfer to any of the open “internal hire only” jobs. If the recruiting manager pulled you into the new job, your current manager could not stop or oppose the transfer. This placed a lot of burdens on managers to properly coach, lead, and challenge their team. Any team manager who was dominating, lacked delegation skills, or always issued orders instead of letting engineers do their job was soon exposed because people transferred out, and no one wanted to transfer in. Without hiring from the outside (any good engineer would take any job just to get in), the lack of personnel became apparent.
Printed circuit manufacturing was not one of the jobs that electrical engineers in HP wanted to do. EEs were also not the best choice for printed circuit manufacturing because chemical engineers, chemists, and mechanical engineers had more skills useful to support the PCB manufacturing process. Therefore, I was authorized to recruit external hires. I was part of the college recruiting team, as 90% of HP engineers were recruited from universities (BS, MS, or Ph.D.). HP’s process for college recruiting was based on an early form of networking. HP maintained close contact with department heads and head professors of engineering departments at favored universities.
To recruit chemical engineers, we went to those universities noted for their focus on industries like electronics, process control, and environmental. I contacted the department heads for chemical engineering at five noted universities, including my alma mater. We asked professors to give us the names of their most talented graduating students that would likely be interested in a career in electronics. We contacted the students and scheduled appointments to interview them at a time convenient for them rather than the fixed slots at the engineering placement office. Most chemical engineers were not looking for careers in electronics, but rather in petroleum, chemicals, pulp and paper, or energy.
To read this entire article, which appeared in the December 2020 issue of SMT007 Magazine, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Unlocking the Promise of AI in Electronics Manufacturing
10/29/2025 | Shobhit Agrawal, Keysight TechnologiesThe electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
11/04/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.