DENSO, Aeva Collaborate to Bring FMCW 4D LiDAR to Mass Vehicle Market
January 19, 2021 | Business WireEstimated reading time: 1 minute
Aeva Inc., a leader in next generation sensing and perception systems, has announced a collaboration with DENSO, a leading global mobility supplier of advanced automotive technology for major automakers, to bring Aeva’s 4D LiDAR technology to the mass vehicle market.
Aeva’s 4D LiDAR technology is the only viable Frequency Modulated Continuous Wave (FMCW) technology to enable automated driving for series production. Built from the ground up on proprietary silicon photonics technology, Aeva’s 4D LiDAR combines instant velocity measurement for each pixel, long range at high resolution, immunity to other LiDAR or sunlight interference, and scalability at industry leading costs on proven semiconductor processes.
“DENSO is a leader in commercializing advanced technologies at affordable costs and our collaboration is further evidence that Aeva’s 4D LiDAR provides what we believe will be an unparalleled combination of superior performance and scalability,” said Soroush Salehian, Co-Founder and CEO at Aeva. “We’re excited to work alongside DENSO to bring Aeva’s 4D LiDAR to global OEMs looking to implement automated driving across their vehicle programs at scale.”
“Aeva’s FMCW 4D LiDAR solution addresses the missing link for perception in automated driving and advanced driver-assistance systems, with its unique ability to meet the stringent automotive performance and safety requirements,” said Kazuma Natsume, Director of AD & ADAS Engineering Div. 2 at DENSO. “We look forward to collaborating with Aeva to further develop FMCW LiDAR, bring it to the mass market and create a society free from traffic accidents.”
Aeva is engaged with 30 of the top OEM and automotive industry players in the advanced driver assistance and autonomous driving industries, has received strategic investments from Porsche SE, the majority shareholder of VW Group, and has relationships with some of the largest Tier 1 automotive suppliers.
Aeva remains on track to complete its previously announced business combination agreement with InterPrivate Acquisition Corp, a publicly traded special purpose acquisition company, in the first quarter of 2021. The business combination is expected to provide up to $563M in gross proceeds. The combined company is expected to be listed on the New York Stock Exchange under the ticker symbol, “AEVA”.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
High-Tech Hill Technology Park Opens: Four New Factories Launched
09/26/2025 | TeltonikaThe ambitious vision announced in late 2020 to build a world-class technology park in Liepkalnis, Vilnius, has become a reality. AGP Investments, led by entrepreneur Arvydas Paukštys, together with high-tech leaders Teltonika and TLT, today inaugurated four new factories at the Vilnius High-Tech Hill Technology Park.
LPKF to Unveil CuttingMaster 2240 Cx at Productronica
09/26/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics SE will be showcasing the CuttingMaster 2240 Cx as part of the Fraunhofer IZM production line at this year's Productronica in Munich, demonstrating state-of-the-art laser technology in action.
Signal Integrity: A Game of Margins
09/25/2025 | Andy Shaughnessy, Design007 MagazineAs the founder of Wild River Technology, Al Neves deals with some of the most challenging aspects of signal integrity. Wild River’s engineers consult with high-tech companies that work at very high speeds and frequencies, often above 100G. Al is always a fun interview, so we asked him to share his thoughts on the current state of signal integrity engineering.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/25/2025 | I-Connect007The final episode of the On the Line With…Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover
09/26/2025 | I-Connect007Episode 3 of On the Line With... American Standard Circuits, “How Does Ultra HDI Benefit: Routing Capabilities,” features host Nolan Johnson in conversation with returning guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI technology is transforming design for manufacturability and expanding what’s possible in routing capabilities.