Fibocom to Deliver Top-Class Commercial-Ready nuSIM IoT Module
February 5, 2021 | Business WireEstimated reading time: 2 minutes
Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, announces that it will collaborate with Deutsche Telekom, a world's leading integrated telecommunications company, and Redtea Mobile, a pioneering connectivity solution provider, to deliver a top-class commercial-ready nuSIM module. Fibocom MA510-GL is a global LPWA multi-RAT module (GPRS/NB/LTE-M) that is widely used in smart meters, smart parking, wearable devices, asset tracking and smart city applications.
nuSIM is an integrated SIM solution dedicated to the IoT market, allowing IoT applications to eliminate the use of physical SIM cards. The nuSIM functionality is fully integrated into the module chips. That allows the module to offer clear design advantages in minimum hardware and software footprint and significant space savings on the PCB. These advantages will ultimately be reflected in smaller device size, reduced device cost and lower power consumption. By optimizing SIM functionality, profile load interfaces and removing the dependency on SMS & heavy eSIM protocol, the power consumption of the nuSIM module is up to 90% lower than the traditional SIM solution, making it ideal for mobile IoT devices that demand extended battery life. Without relying on physical SIM card slots, the nuSIM solution will also address benefits in improved data security and better protection from dust, moisture, temperature and vibrations.
“Fibocom is glad to be an early mover on the commercial launch of nuSIM module. The nuSIM technology will be an ideal solution for the massive rollout of mobile IoT devices. Through the great simplicity, outstanding cost performance, the ultra-low power consumption of the MA510 nuSIM module, Fibocom will be able to deliver competitive advantages to customers in diverse vertical industries, allowing them to bring IoT solutions to market with the lowest capital and time investment,” said Lars Thyroff, Managing Director, Fibocom EMEA.
“I am proud to see our nuSIM initiative growing with IoT modules from Fibocom,” adds Stefan Kaliner, Head of UICC Development at Deutsche Telekom. “We defined an integrated SIM, straight forward and yet secure, to answer an obvious market need. With Fibocom on board we are able to cover another large chunk of the IoT market, bringing simplicity to where it makes sense.”
“We are honored to work with industry pioneers including Deutsche Telekom and Fibocom to demonstrate our value in the shared ecosystem by jointly providing a commercial-ready means for SIM innovation to simplify deployment and optimize cellular connectivity in the IoT space globally,” said Xiaodong Guo, VP of Strategic Partnerships & Projects at Redtea Mobile. “The new nuSIM module will be an ultra-low power product that can bring clear benefits of lower costs, higher SIM dispatch efficiency, streamlined SIM lifecycle management, and overall design simplicity to our customer.
Suggested Items
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswireIn 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.
The Big Picture: Our Big ‘Why’ in the Age of AI
06/25/2025 | Mehul Davé -- Column: The Big PictureWith advanced technology, Tesla, Google, Microsoft, and OpenAI can quickly transform life as we know it. Several notable artificial intelligence (AI) studies, including the 2024 McKinsey Global Survey on AI, have offered insights into AI’s adoption, impact, and trajectory. The McKinsey study revealed that AI adoption continues to grow, with 50% of respondents reporting using AI in at least one business area.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
PC AIB Shipments Follow Seasonality, Show Nominal Increase for Q4’24
06/06/2025 | JPRAccording to a new research report from the analyst firm Jon Peddie Research, the growth of the global PC-based graphics add-in board market reached 9.2 million units in Q1'25 and desktop PC CPUs shipments decreased to 17.8 million units.
Dalfen Industrial Closes Major Sale of One Million+ SF Houston Logistics Park to Global Tech Giant Foxconn
06/06/2025 | Globe NewswireDalfen Industrial recently announced the sale of Fairbanks Logistics Park, a premier four-building, 1,026,609-square-foot Class A industrial campus in Northwest Houston, to Foxconn.