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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Aismalibar Adds Arkeo Stack to Library of Software Tools
February 9, 2021 | AismalibarEstimated reading time: 1 minute

Aismalibar thermal conductive laminates, has added Arkeo Stack software to their library of software tools aimed at offering additional “value add” for their customer base. This advanced software offers PCB manufacturers the option of having Aismalibar create or evaluate a proposed build for a specific PCB design requirement. The software will calculate the thermal impedance for each layer as well as the complete build ensuring it will produce the required results.
Jeff Brandman, president of Aismalibar North America, says, “Those of you who know Aismalibar, know that we are always striving to find better ways to help our customers. That’s why we are so proud to add Arkeo Stack to our library of software tools that provide our customers with more value-benefits of working with us and with our fine line of Aismalibar Thermal conductive laminates.”
The Arkeo Stack software is preloaded with all the latest industry materials including IMS and heat sink materials. Offering accurate thermal impedance calculations, it also offers the ability to model thermal impedance values for sub-assemblies. The software includes all the necessary IMS thermal material information to be able to accurately design a stack up where thermal performance is key. Utilizing the APSIM impedance modelling platform the software also offers detailed impedance calculations.
Arkeo Stack is a fully automated, stack up generation software tool that quickly builds accurate and cost-conscious stack ups. Having your build created or double checked by Aismalibar reduces engineering time and costs while creating consistent, reliable builds. Arkeo Stack has a custom report generator that builds reports to suit the specific needs of your company during the processing and testing of your IMS printed circuit board.
This service is proudly offered to customers who purchase Aismalibar thermal conductive laminates. The service is designed to assist you to achieve the perfect stack up using thermal conductive materials. Aismalibar’s field application engineers have extensive experience in thermal management and PCB manufacturing and are ready to assist you with your PCB stack-up to achieve best results.
About Aismalibar
Aismalibar has over 60 years of experience manufacturing high end copper and metal clad laminates for the printed circuit board industry. During the last two decades, Aismalibar has been focused on offering the best solutions to reduce the operational temperature of printed circuit boards. For more information, visit www.aismalibar.com.
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