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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Aismalibar Adds Arkeo Stack to Library of Software Tools
February 9, 2021 | AismalibarEstimated reading time: 2 minutes
Aismalibar thermal conductive laminates, has added Arkeo Stack software to their library of software tools aimed at offering additional “value add” for their customer base. This advanced software offers PCB manufacturers the option of having Aismalibar create or evaluate a proposed build for a specific PCB design requirement. The software will calculate the thermal impedance for each layer as well as the complete build ensuring it will produce the required results.
Jeff Brandman, president of Aismalibar North America, says, “Those of you who know Aismalibar, know that we are always striving to find better ways to help our customers. That’s why we are so proud to add Arkeo Stack to our library of software tools that provide our customers with more value-benefits of working with us and with our fine line of Aismalibar Thermal conductive laminates.”
The Arkeo Stack software is preloaded with all the latest industry materials including IMS and heat sink materials. Offering accurate thermal impedance calculations, it also offers the ability to model thermal impedance values for sub-assemblies. The software includes all the necessary IMS thermal material information to be able to accurately design a stack up where thermal performance is key. Utilizing the APSIM impedance modelling platform the software also offers detailed impedance calculations.
Arkeo Stack is a fully automated, stack up generation software tool that quickly builds accurate and cost-conscious stack ups. Having your build created or double checked by Aismalibar reduces engineering time and costs while creating consistent, reliable builds. Arkeo Stack has a custom report generator that builds reports to suit the specific needs of your company during the processing and testing of your IMS printed circuit board.
This service is proudly offered to customers who purchase Aismalibar thermal conductive laminates. The service is designed to assist you to achieve the perfect stack up using thermal conductive materials. Aismalibar’s field application engineers have extensive experience in thermal management and PCB manufacturing and are ready to assist you with your PCB stack-up to achieve best results.
About Aismalibar
Aismalibar has over 60 years of experience manufacturing high end copper and metal clad laminates for the printed circuit board industry. During the last two decades, Aismalibar has been focused on offering the best solutions to reduce the operational temperature of printed circuit boards. For more information, visit www.aismalibar.com.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.