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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Meet the Author Podcast: Exploring the Growing Role of UV Curable Conformal Coatings with Dow

07/13/2026 | I-Connect007
UV curable conformal coatings are gaining momentum for good reason. Faster processing, simplified manufacturing, and improved reliability have made the technology an attractive option for electronics manufacturers looking to improve production without sacrificing performance. In the latest Meet the Author podcast from I-Connect007, Managing Editor Nolan Johnson welcomes Brian J. Chislea and Cody Schoener, PhD, of Dow, Inc. to discuss their new book, The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings.

Dan’s Biz Bookshelf: ‘Atomic Habits’

06/03/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
If there’s one business book I recommend more than almost any other, especially to leaders, engineers, and sales professionals trying to get better every single day, it’s Atomic Habits by James Clear. If you’ve already read it, you know this isn’t a book about motivation. It’s not about hype, hustle, or “just try harder.” It’s about something far more practical, and far more powerful: building systems that make success inevitable. That’s what makes Atomic Habits so valuable.

Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.

May SMT007 Magazine: Putting North America in Focus

05/04/2026 | I-Connect007 Editorial Team
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing. Read this issue of SMT007 Magazine now and see where the region is headed.

Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics

03/18/2026 | I-Connect007
I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.
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