Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
April 1, 2025 | JCN NewswireEstimated reading time: 1 minute
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025. The five-day event themed 'Fascinating Electronics for a Cool World’ is designed to inspire and attract new talent to Europe's electronic components and systems sector. This year’s session will take place at the Budapest University of Technology and Economics in Hungary from August 24-29, 2025.
The program will feature interactive workshops, expert-led discussions, networking sessions, and practical insights into cutting-edge microelectronics and semiconductor technologies. Students enrolled in STEM-related fields from universities across the EU or associated countries are invited to apply until 30 April 2025.
"Initiatives like the ECS Summer School are crucial for inspiring and nurturing the next generation of talent fueling the talent pipeline," said Laith Altimime, President of SEMI Europe.
By engaging directly with leading experts, students will acquire skills and insights essential for their future roles in Europe's rapidly evolving technology landscape.
"The ECS Summer School is an excellent gateway for students to gain practical knowledge and establish valuable industry connections,” said Patrick Cogez, Technical Director at AENEAS and lead partner in ECSA for the organisation of the Summer School.
Applications are now open to STEM students enrolled at universities in the EU and associated countries who have completed at least two years of undergraduate studies and have at least one more year of study ahead. The ECS Summer School 2025 is entirely free for selected participants, with applications closing on 30 April 2025 at 17:00 CET.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.