Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Kuprion Introduces ActiveCopper Filled Thermal Vias
February 12, 2021 | Kuprion, Inc.Estimated reading time: 2 minutes
Kuprion, Inc., a spinout of Lockheed Martin, has introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.
Lead-free and RoHs-compliant, ActiveCopper is a flowable, engineered copper paste—a dense and sticky form of copper, which is safe to handle in air. To enhance heat and power dissipation, ActiveCopper Filled Thermal Vias provide a more efficient heat dissipation path directly incorporated into PCBs with placement directly under a surface-mounted IC ‘heat source’ that allows direct surface mount bonding for maximum heat transfer using Kuprion’s surface mount copper material. Placing the large 3-5mm diameter thermal vias directly underneath an IC allows direct bonding to such a via, and enables significant reduction in thermal resistance. This facilitates efficient heat dissipation not only on the top surface, but through the PCB to the back side.
“The heat generated by integrated circuits poses great challenges, especially given today’s faster speeds, reduced board real estate and the multitude of devices being populated on PCBs. These demands require more efficient methods of heat and power dissipation to ensure product performance and life for increasingly complex electronic systems,” stated Nick Antonopoulos, CEO at Kuprion. “The PCB by nature, like common FR4 material, is not a good thermal conductor. It’s made of substrate materials that are insulating electrical interconnections between components, but ActiveCopper Filled Thermal Vias provides an ideal solution.”
Kuprion’s Active Cu (ActiveCopper) Thermal Via paste is easily applied by printing, or squeegeeing into these vias, where it is converted into bulk copper during processing. This allows for thermal conductivity of at least 150 W m-1 K-1, and fills holes from micro vias to 4+ mm diameter vias while sintering at approximately 200°C. Additionally, there is no re-melting after sintering, allowing for unlimited reflow sequences.
ActiveCopper Filled Thermal Vias are ideal for advanced high power/high performance applications such as 5G transreceivers/power amplifiers, industrial LEDs, graphics cards, data servers, routers, and automotive lighting with the following advantages:
- Lead-free, RoHs-compliant; nearly 100 percent densified bulk copper after sintering
- No re-melting after sintering; converts to bulk copper (m.p. 1084°C)
- Enables unlimited reflow sequences
- Thermal conductivity: 150 - 160 W m-1 K-1
- Rapid processing: 20 - 40 minutes; no-clean material system
- Proven solution backed by 12+ years of R&D
- Cost-effective and ready for immediate use for a range of global customer applications
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.