IBIDEN Selected as 'Yearbook Member' by S&P Global
February 16, 2021 | IBIDENEstimated reading time: Less than a minute
IBIDEN Co, Ltd. announces that it has been selected and listed in The Sustainability Yearbook by S&P Global as "Yearbook Member" for this year.
Every year, S&P Global evaluates the major companies of the world in economic, environmental and social aspects, and finally selects the top 15% companies, from each industry, who are also within 30% in difference of score from the top as entities with excellent sustainability.
This year, 7,032 companies from 61 industries were put on the evaluation board, from which 631 companies (78 from Japan) have been selected.
IBIDEN Group upholds a "harmonious relationship with the natural environment" and the "realization of the progression of society" as key goals in its Corporate Philosophy. The Group has continued to grow by developing products that can lead to solving social problems with its innovative technologies. Considering that contribution to the progression of society and solving social problems through its business are the essence of its Corporate Philosophy, the Group will continue to engage in ESG (environment, society, and governance) activities.
This year, 7,032 companies from 61 industries were put on the evaluation board, from which 631 companies (78 from Japan) have been selected.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TSMC and South Korean Rivals Lose U.S. Fast-Track Export Privileges for China
09/03/2025 | I-Connect007 Editorial TeamWashington has revoked Taiwan Semiconductor Manufacturing Co.’s (TSMC) special fast-track status for U.S. chip-making equipment exports to its Nanjing, China, plant, Reuters reported on Sept. 2. The move comes days after similar actions against South Korean chip makers Samsung Electronics and SK Hynix.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Power Shift in U.S. Manufacturing Ownership
08/20/2025 | Nolan Johnson, I-Connect007The U.S. manufacturing landscape is driven by reshoring initiatives, supply chain realignments, and a surge of foreign interest. What does that mean for U.S.-based PCB and EMS companies? In this interview, mergers and acquisitions expert Tom Kastner breaks down the forces reshaping the industry—why foreign investors are eager to enter the U.S. market, why many are evaluating greenfield facilities over acquisitions, and why the high-mix, low-volume focus of most domestic shops doesn’t always align with foreign buyers’ goals.
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
08/12/2025 | Prashant Patel -- Column: Facing the FutureFor decades, offshore manufacturing dominated the global electronics industry. The pursuit of cost efficiency, scalability, and access to vast labor markets made countries like China, Taiwan, and Vietnam attractive destinations for printed circuit board (PCB) production. But a seismic shift is underway, from geopolitical instability and supply chain disruptions to rising labor costs and national security concerns.
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.