Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area 
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
September 4, 2025 | I-Connect007Estimated reading time: Less than a minute
In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Optimize the InterconnectSM series explores how MKS is reshaping microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
Listeners can also download a free companion guide for a deeper technical dive into unified via formation. The guide includes case studies that showcase the measurable performance gains of OTI in action.
Stay tuned—the final episode in the series airs Sept. 18.
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