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ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering

04/21/2025 | ASC Sunstone
In a major step toward simplifying the PCB manufacturing and assembly process, ASC Sunstone Circuits and Screaming Circuits are proud to announce the launch of a new online assembly parts ordering feature, now available through Sunstone.com.

IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President

04/16/2025 | IPC
IPC, the global electronics association, announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth. 

Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology

04/16/2025 | Real Time with...IPC APEX EXPO
Andy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.

KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies

04/16/2025 | KOKI
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.

Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
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