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Hentec/RPS Setting Component Lead Tinning Standards and Compliance
March 31, 2021 | Hentec Industries Inc.Estimated reading time: Less than a minute

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that its entire series of Odyssey component lead tinning machines provide full compliance with all applicable industry standards. The Odyssey 925, 1325 and 1750 component lead tinning machines perform component re-conditioning in accordance with all relevant GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards. The full line of Odyssey 925, 1325 and 1750 component lead tinning machines are specifically designed to perform component re-conditioning including re-tinning, gold removal and BGA de-balling for high reliability and military applications.
The Pulsar solderability test equipment performs the industry accepted dip-and-look test method for rapid solderability results that can easily performed on the shop floor. In addition, the Photon steam aging system is designed to provide artificial aging and accelerated life testing to simulate elongated component storage conditions.
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Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
06/17/2025 | Jesse Vaughan -- Column: Beyond the Board“The next war might be won—or lost—22,000 miles above Earth.” That’s not science fiction. It’s the stark reality defense planners are beginning to confront as space transitions from a support domain to a full-spectrum warfighting environment. For decades, the United States held an uncontested advantage in space, relying on exquisite, few, and highly capable systems to enable precision warfare, real-time intelligence, and global communications. Today, that edge is under siege.