Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Hentec/RPS Setting Component Lead Tinning Standards and Compliance
March 31, 2021 | Hentec Industries Inc.Estimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that its entire series of Odyssey component lead tinning machines provide full compliance with all applicable industry standards. The Odyssey 925, 1325 and 1750 component lead tinning machines perform component re-conditioning in accordance with all relevant GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards. The full line of Odyssey 925, 1325 and 1750 component lead tinning machines are specifically designed to perform component re-conditioning including re-tinning, gold removal and BGA de-balling for high reliability and military applications.
The Pulsar solderability test equipment performs the industry accepted dip-and-look test method for rapid solderability results that can easily performed on the shop floor. In addition, the Photon steam aging system is designed to provide artificial aging and accelerated life testing to simulate elongated component storage conditions.
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