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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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APCT Increases Technology with Rigid Flex Optical Registration from DIS
April 8, 2021 | APCTEstimated reading time: 2 minutes
APCT Inc has added Rigid Flex Optical Registration™ (RFS), developed by DIS Inc of Islandia, N.Y. to enhance their PCB registration capabilities. The RFS machine is built specifically to process difficult flex, rigid and rigid-flex jobs. Using DIS, Inc proprietary Optical Registration™ technology in conjunction with SmartWeld, the RFS has the ability to align inner-layers and pre-preg without the use of expensive pin-tooling.
Optical Registration™ allows for optical alignment of inner layers during the lay-up process of multi-layers and sequential build-up technology, eliminating the need to manually punch and pin individual layers prior to lamination. The tolerance build-up and variability associated with traditional pin lamination systems is eliminated.
A vision and positioning system sequentially align and clamp layers together utilizing a full platen, assuring coplanarity and accuracy. The aligned multi-layers are welded together with SmartWeld™, the patented coupled induction welding system developed by DIS Inc.
In addition, Optical Registration™ provides an opportunity to utilize X-ray inspection to quantify registration of welded multi-layers prior to lamination. The panel can then be measured after lamination, providing the data to analyze the lamination process and take corrective actions if necessary.
The process has been in use worldwide at both high tech and high-volume shops over the past several years. Some of the leading-edge requirements placed on PCB shops utilizing pin technologies are not able to be met unless they introduce Optical Registration.
About APCT Inc.
APCT is a leading manufacturer of high reliability rigid printed circuit boards. Located in Anaheim California, the plant is designed to facilitate world class cycle times and support a broad range of technologies. Their corporate culture focuses on continuous improvement and strives for “best in class” in service and support. APCT is ISO9001:2008, IPC 6012 Class III certified and ITAR registered.
About DIS Inc.
DIS Inc. is a worldwide leader in optical registration systems for the printed circuit board industry and an innovative producer of inner-layer/sub-lam registration and welding equipment. DIS has developed Direct Optical Registration™, a new method of optically registering and welding inner-layers/sub-lam such that registration is improved by eliminating mechanical tooling, operational cycle times are reduced and process flexibility is increased all while significantly reducing operating costs.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.