Cadence Collaborates with Arm to Accelerate Hyperscale Computing, 5G Communications SoC Development
April 27, 2021 | Business WireEstimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that it is expanding its collaboration with Arm to speed hyperscale computing and 5G communications SoC development using Cadence® tools and the new Arm® Neoverse™ V1 and Neoverse N2 platforms. To build upon previous silicon successes where leading customers used the first-generation Arm Neoverse N1 platform and Cadence digital and verification tools on 7nm process technologies, Cadence optimized its digital and verification full flows to drive adoption of these latest platforms. Cadence also delivered comprehensive 5nm and 7nm RTL-to-GDS digital flow Rapid Adoption Kits (RAKs) to help customers optimize power, performance and area (PPA) goals and improve productivity.
Digital Full Flow and RAKs
The integrated digital full flow from Cadence has been proven on a 5nm, 4GHz Neoverse V1 implementation, delivering cutting-edge performance—a key capability of the Neoverse platforms. Customers working on advanced-node designs, including 3D-IC chiplets, can use the new Cadence 5nm and 7nm RAKs to implement data center server-class CPUs more efficiently and speed time to tapeout. The complete Cadence RTL-to-GDS RAKs include the Genus™ Synthesis Solution, Modus DFT Software Solution, Innovus™ Implementation System, Quantus™ Extraction Solution, Tempus™ Timing Signoff Solution and ECO Option, Voltus™ IC Power Integrity Solution, Conformal® Equivalence Checking and Conformal Low Power.
The digital full flow provides some key features to speed the delivery of 5nm and 7nm server-class designs, including:
- Cadence iSpatial technology, which provides an integrated, predictable implementation flow for faster design closure
- Integrated Tempus timing and Voltus IR analysis for true power integrity-driven timing signoff and optimization, which enables designers to deliver more reliable devices
- The Tempus ECO Option offers signoff-accurate final design closure using path-based optimization to achieve optimal PPA
Verification Full Flow and Engines
In addition to benefiting from Cadence’s proven 5nm, 4GHz digital full flow, companies building Arm Neoverse-based SoCs can achieve the highest SoC-level verification throughput by leveraging Cadence’s verification full flow. In particular, the Cadence System VIP solution has been enhanced with checkers, verification plans and traffic generators to verify Arm Neoverse-based SoC coherency, performance and Arm SystemReady compliance. All Cadence verification engines, comprising Xcelium™ Logic Simulation, Palladium® Z1 Emulation, Protium™ X1 Prototyping and JasperGold® Formal Verification, are leveraged by these System VIP extensions to deliver a comprehensive SoC-level verification flow for Arm Neoverse-based SoCs.
“The modern infrastructure requires greater performance and power efficiency to manage next-generation high-performance computing and cloud-to-edge workloads,” said Chris Bergey, senior vice president and general manager, Infrastructure Line of Business, Arm. “By working with Cadence to optimize its digital and verification full flows for Arm Neoverse-based solutions, our customers can develop industry-leading products with optimal PPA.”
“Arm and Cadence have a long history of collaborating on Arm IP development, with the Neoverse V1 and Neoverse N2 platforms being the most recent example,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By evaluating past customer successes with the Neoverse N1 platform, we’ve successfully optimized the Cadence digital and verification full flows to create high-frequency, low-power, high-quality server-class designs using Arm’s newest infrastructure platforms. With the new 5nm and 7nm RAKs and System VIP tools, our data center and 5G infrastructure customers can rapidly deliver innovative silicon solutions on schedule.”
The Cadence digital full flow provides customers with a fast path to design closure and better predictability. The Cadence verification full flow is comprised of best-in-class engines, verification fabric technologies and solutions, which improve verification throughput. The Cadence flows support the broader Cadence Intelligent System Design™ strategy, enabling customers to achieve design excellence.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
04/17/2025 | Matt Stevenson -- Column: Connect the DotsIf you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
04/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.