Siemens Selects Tangent Works to Democratize IoT Data Analytics for MindSphere
April 30, 2021 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software announces a partnership with Tangent Works to deliver simple-to-use artificial intelligence (AI) capabilities to get more value from IoT data. The new AI for Everybody solution integrates the power of Tangent Works InstantML technology into MindSphere®, the industrial IoT as a service solution from Siemens, to enable users to instantly leverage IoT data collected by MindSphere to generate new insights without the need for complex model training and management.
Many organizations still struggle to scale their digital transformation projects and leverage IoT data using advanced artificial intelligence (AI) and machine learning (ML) technologies. Machine learning offers tremendous opportunities for industrial applications. However, it often requires deep knowledge about advanced statistics and how it’s applied in industrial use cases, as well as the scarce and expensive resource of data science experts.
“We are witnessing massive investments into digital and AI as companies get ready for post Covid-19 operations. Already before the pandemic, our research showed that a shortage of digital talent, especially in IT and data science, was the biggest challenge for companies looking to realize IoT, Industry 4.0 and AI initiatives,” said Knud Lasse Lueth, CEO at IoT Analytics. “This challenge will only get worse in the coming years and most firms will simply not find the experts that can build the machine learning models and integrate them into everyday operations. Companies that cannot find or afford these highly specialized digital employees will turn to low-code software tools to empower non-technical employees, or ‘citizen developers’.”
Using Tangent Works’ InstantML as an embedded component in MindSphere gives industrial users the ability to very quickly add AI capabilities to their MindSphere applications and solutions. With this approach, the IoT data stored in MindSphere can be instantly leveraged to generate actionable insights and prescriptive tools, enabling important industry use cases such as predictive maintenance, performance optimization, quality management and energy management.
“We always believed in the potential of our InstantML technology for industrial data,” said Henk De Metsenaere, co-founder of Tangent Works. “Now that Siemens, the true market leader in this space, has teamed up with Tangent Works this potential can be unlocked. The combination of Siemens’ MindSphere with Tangent Works’ InstantML technology will change the way industrial data will be used to the benefit of many of Siemens’ clients.”
“With the AI for Everybody solution, and with the integration of Tangent Works’ InstantML technology, customers and partners can now more quickly and easily extend the capabilities of MindSphere to better turn data into real and actionable insights and value,” said Raymond Kok, Senior Vice President of Cloud Application Solutions at Siemens Digital Industries Software. “With the ability to use AI/ML to generate hyper-automated predictive analytics, even citizen data scientists can leverage data and achieve immediate insights, at scale. This ultimately reduces complexity and puts the power of IoT data in the hands of the user.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.