-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Peters’ ELPEGUARD Gel Receives UL Approval
May 3, 2021 | PetersEstimated reading time: 1 minute
The Peters ELPEGUARD gel EH 13.401 FLZ-UV-HT has received Underwriters Laboratories (UL) approval. This means that the Peters gel for dam-and-fill applications has undergone and passed the flammability test in horizontal burning.
Defining parameters for the flammability of plastics for parts in equipment and applications in the presence of an open flame using a Bunsen burner, the UL94 standard certifies that the Peters ink system meets the requested fire protection classification.
"These are the strict eyes of the globally recognised and independent U.S. organisation that examines products, components and systems with regard to their safety and certifies them with a Yellow Card if they pass the test," reports Stefan Schröder, product manager for conformal coatings at Peters.
"Dam-and-fill" applications help protect highly complex areas within an assembly, achieved through the application of a barrier which is then sealed by a flowable material. Dam structures can be applied, for example, around connector strips, components and contact surfaces to prevent penetration or spreading of the subsequently applied conformal coating. Due to the smooth flow after application, components "legs" are completely enclosed.
The conformal coating ELPEGUARD SL 1307 FLZ-T gels of the EH 13.401 FLZ-UV series are available in practical cartridge filling or fillable for dispersing systems. These gels, which are available both in colourless-transparent and fluorescent versions, are thixotropic, solvent-free and purely UV-curing ink systems based on acrylate resins that can be applied with pinpoint accuracy. Perfect conformal coating for most difficult applications.
"Thixotropic means that the longer you stir the liquid, the thinner it becomes," explains Schröder. In the case of Peters inks this means that the thixotropic adjustment does not run—e.g., on a printed circuit board—and can therefore be used on critical plug connections and components with high capillary action, too.
The coating also provides reliable protection against contact, especially on solder pins. The highly elastic dam minimises the risk of cracks during temperature changes. UV curing takes place at approx. 4000 mJ/cm², which means that curing is complete, uniform and efficient, resulting in a brilliant and scratch-resistant surface. Visit www.peters.de
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.