Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

MKS’ Atotech, ESI Showcase Next-gen PCB and Advanced Packaging Solutions at JPCA 2025

06/04/2025 | MKS’ Atotech
MKS, through its leading surface finishing brand Atotech® and laser system brand ESI®, proudly announces its participation at the 2025 JPCA Show in Tokyo, Japan, from June 4–6. At booth 6D-01, the company will highlight the combined power of its strategic brands Atotech® and ESI®, showcasing the latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing.

MKS Opens New State-of-the-Art Facility in Derio, Spain to Strengthen Iberian and Southern European Presence

05/28/2025 | MKS’ Atotech
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, proudly announces the official opening of its new facility in Derio, Bizkaia, Spain, a strategic investment designed to support the company’s General Metal Finishing business across the Iberia Region, including Spain and Portugal.

Real Time with... IPC APEX EXPO 2025: MKS' Atotech—Leading Innovations in Semiconductor Solutions

03/28/2025 | Real Time with...IPC APEX EXPO
In this interview, Marcy LaRont speaks with Kuldip Johal, CTO, MKS’ Atotech. Based in Boston, MKS operates in vacuum solutions, photonics, and specifically for the Atotech division, material solutions.  MKS significantly impacts the semiconductor industry, supplying components for up to 85% of global semiconductor tools and covers processes and materials for 70% of PCB manufacturing steps.

Atotech to Participate at KPCA Show 2024

09/03/2024 | Atotech
MKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.

MKS’ Atotech and ESI Participate in Electronics Circuit Asia in Thailand

07/25/2024 | Atotech
MKS Instruments announces its participation at the Electronics Circuit Asia 2024 in Thailand, July 24-26, highlighting its leading brands Atotech® and ESI® and related advances in advanced packaging, package substrate, and printed circuit board manufacturing.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in