-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Stellantis, Foxconn to Develop Breakthrough Digital Cockpits with Mobile Drive Joint Venture
May 18, 2021 | StellantisEstimated reading time: 2 minutes
Stellantis NV and Hon Hai Precision Industry Co., Ltd., (Foxconn), together with its subsidiary FIH Mobile Ltd., announced the signing of a non-binding memorandum of understanding to form Mobile Drive, a 50/50 voting rights joint venture aimed at accelerating development timelines to bring innovative in-vehicle user experiences enabled by advanced consumer electronics, HMI interfaces and services that will exceed customer expectations.
Mobile Drive will combine Stellantis’ global vehicle design and engineering expertise with Foxconn’s global development in the rapidly changing software and hardware realms of smartphones and consumer electronics. The combination will position Mobile Drive at the forefront of global efforts to deliver a new frontier of in-cabin information and entertainment capabilities, seamlessly connected inside and outside the vehicles in which they are installed.
“Today, there’s something that matters just as much as beautiful design or innovative technology, it’s how the features inside our vehicles improve the lives of our customers,” said Carlos Tavares, Chief Executive Officer at Stellantis. “Software is a strategic move for our industry and Stellantis intends to lead with Mobile Drive, a company that will enable the swift development of connectivity features and services that mark the next great evolution of our industry, just as electrification technology has.”
“The vehicles of the future will be increasingly software driven and software defined. Customers today and, in the future, demand and expect ever increasing software driven and creative solutions to connect the drivers and passengers with the vehicle inside and out. Mobile Drive will meet and exceed these expectations with teams of designers and software and hardware engineers,” said Chairman Young Liu at Foxconn. “This is a natural extension of Foxconn’s global leadership in the development and application of smart technologies to improve the quality of life of consumers around the world.”
All development by Mobile Drive will be co-owned by Stellantis and Foxconn. The Netherlands-based joint venture will operate as an automotive supplier, competitively bidding to supply software solutions and related hardware for Stellantis and other interested automakers.
“Leveraging Foxconn’s extensive knowledge of user experience and software development in mobile ecosystems, Mobile Drive will offer the disruptive smart cockpit solution that will seamlessly integrate the automobile into the driver’s mobile-centric lifestyle,” Calvin Chih, Chief Executive Officer at FIH.
“With this partnership, we will push the boundaries in connected car technology and bring immersive experiences yet to be imagined,” said Yves Bonnefont, Chief Software Officer at Stellantis. “Mobile Drive ultimately gives us the agility we need to provide the digital experience of the future at the speed our customers demand.”
Mobile Drive will focus on infotainment, telematics and cloud service platform development with software innovations expected to include artificial intelligence-based applications, 5G communication, upgraded over-the-air services, e-commerce opportunities and smart cockpit integrations.
Foxconn and Stellantis previously partnered in the development of the Airflow Vision design concept, displayed at CES®, the world's most influential technology event. The concept demonstrated the thinking of both companies in a next-generation of premium transportation and user experience.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.