Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation
May 18, 2021 | IPCEstimated reading time: 1 minute
The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. The technical conference will take place January 25–27, 2022.
“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC APEX EXPO technical conference. A new committee chair and co-chair, expanded committee size, and a new structure enables the group to be future focused and provide a stronger technical voice spanning various technologies and the supply chain,” said Matt Kelly, IPC chief technologist. “The TPC’s mission is to deliver strong, relevant, and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC APEX EXPO 2022 technical conference has in store.”
Led by Beverley Christian, Ph.D., HDP User Group (Chair) and Stanton Rak, Ph.D., SF Rak Co. (Co-Chair) the 24-person committee comprises the following members: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Cheryl Tulkoff, NI; Chris Jorgensen, IPC; Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH; Jason Keeping, Celestica Inc.; Jerry Magera, Motorola Solutions; Martin Goetz, Northrop Grumman Corporation; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano, RBP Chemical Technology, Inc.; Milos Lazic, Indium Corporation; Paige Fiet, Michigan Technological University; Paul Cooke, Asahi Glass Co. Ltd.; Radu Diaconescu, Swissmic SA; Raymond Whittier Jr., BAE Systems; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski, IBM; Steven Bowles, Lockheed Martin Corporation; Tim Burke, Ph.D., Arch Systems Inc.; Todd MacFadden, Bose Corporation; Toya Richardson, IPC; and Udo Welzel, Robert Bosch GmbH.
Technical conference paper abstracts are due June 18, 2021. An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. To submit an abstract, visit www.IPCAPEXEXPO.org/CFP.
Share on:
Suggested Items
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
11/15/2024 | Keysight TechnologiesKeysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).
Neways Partners with MilDef for the Production of Advanced Electronic Components
11/15/2024 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, connectivity and smart mobility companies, announces it has entered into a partnership with MilDef, the developer of world-leading tactical IT solutions, products and systems, made to perform in the toughest conditions.