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Advanced Electronics Packaging Digest

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DARPA THREADS the Needle on Thermal Barriers to RF Power

06/15/2026 | DARPA
Modern military systems, from radar and electronic warfare platforms to communications networks, depend on radio frequency (RF) power amplifiers to transmit signals over long distances.

DARPA-developed Autonomous Helicopter Technology Transitions to U.S. Army

03/23/2026 | DARPA
DARPA’s vision to reimagine the role of human pilots and revolutionize military aviation has culminated in the transition of a DARPA-developed autonomous flight system to the U.S. Army.

DARPA taps RTX to Advance Kilometer-range X-ray Vision

03/03/2026 | DARPA
RTX's BBN Technologies has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) under its X-ray Extreme-range Non-imaging Analysis (XENA) program, aiming to enhance service members' situational awareness in the field.

Thermonat Brings Nanoscale Thermal Prediction to Chip Design

01/21/2026 | DARPA
As microelectronics push far below the 10-nanometer scale, heat has become one of the most significant barriers to next-generation chip performance.

IBM Advances to Next Phase of DARPA Quantum Benchmarking Initiative

11/11/2025 | IBM
IBM announced it has been selected for Stage B, the second of three stages of the Quantum Benchmarking Initiative led by DARPA, the United States Defense Advanced Research Projects Agency.
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