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Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns

10/14/2025 | I-Connect007 Editorial Team
The Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/26/2025 | Marcy LaRont, I-Connect007
Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.

Inside Thailand’s Rising PCB Hub: Touring a Chinese Fab

09/23/2025 | Edy Yu, Editor-in-Chief, ECIO
From industry giants to emerging forces, many electronics companies are painting a grand blueprint for the future, laying out their plans in the investment hotbed of Thailand. This was evident during THECA in Thailand, where the most frequently heard buzzwords on and off the show floor were "going global," "building factories in Thailand," and "supply chain security.” With these insights, and full of expectations and questions collected at the exhibition, my team visited First Quality Circuit Co., Ltd., a subsidiary of Sihui Fuji, located in the Amata Industrial Park in Rayong, Thailand

Global Citizenship: Together for a Perfect PCB Solution

09/10/2025 | Tom Yang -- Column: Global Citizenship
If there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.

Materials and Manufacturing for the AI Era: The Next PCB Frontier

08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial Team
AI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards,  expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
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