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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction

04/20/2026 | Kuldip Johal, MKS' Atotech
The rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.

Lattice Materials Awarded $18.5 Million from the U.S. Department of War

12/30/2025 | PRNewswire
Lattice Materials (Lattice), an advanced manufacturer specializing in custom-grown silicon and germanium crystals and part of The Partner Companies (TPC), announced it received an $18.5 million award from the U.S. Department of War (DoW) via Title III of the Defense Production Act (DPA) to further strengthen the U.S. supply chain for germanium and silicon.

Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials

09/29/2025 | Space Forge Inc.
Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.

OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.

Discovery Opens Doors for Cheaper and Quicker Battery Manufacturing

04/23/2025 | PNNL
The discovery centers on sublimation, a commonly known process whereby under the right conditions, a solid turns directly into a vapor. Sublimation is what creates the tail of a comet as it flies by the sun. As the comet’s icy shell heats up, the ice instantly becomes vapor, instead of first melting into liquid water.
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