Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Rehm to Appear at EPP InnovationsFORUM and ‘Wir gehen in die Tiefe’
June 23, 2021 | Rehm Thermal SystemsEstimated reading time: 2 minutes
They’re back. The first face-to-face events for a long time are taking place again, including the EPP InnovationsFORUM in Leinfelden in July and the "Wir gehen in die Tiefe" seminar in Leipzig in September.
Rehm Thermal Systems will be attending and speaking at both events. At the EPP InnovationsFORUM, Michael Hanke, chief sales officer for Rehm, will discuss ProMetrics, a software tool for monitoring thermal profiles during soldering, while at "Wir gehen in die Tiefe," Gianfranco Sinistra, product sales director for dispensing and coating, will give a presentation about Rehm’s versatile conformal coating solutions.
Thanks to the steadily falling Covid rate and an appropriate hygiene concept, the EPP InnovationsFORUM can now take place as a live, in-person event on July 7, 2021 at the Filderhalle in Leinfelden. The success in previous years has made this one of the most important industry events, where specialists can learn from one another, exchange experience and listen to talks by leading experts.
In 12 specialist talks, plus direct experience exchange with high-level specialists and other colleagues, the seminar provides a comprehensive overview of which technologies look set to hold the greatest prospects for success. The keynote speaker this year will be Joey Kelly, with a talk entitled "No Limits."
Hanke will give a talk on "Perfect profiling and monitoring." With ProMetrics, Rehm Thermal Systems has a software tool for monitoring thermal profiles during soldering. This checks how well the previously created profile corresponds to the required, predefined specifications. The process window index (PWI) ascertained in this way is a statistical measure that quantifies the quality of a thermal process.
Sinistra will speak on Wednesday, September 22 at 11:15 on "Dispensing and coating for the protection of electronic assemblies." Coating technology in the electronics industry continues to advance. The many materials and application methods are specifically tailored to the assembly being manufactured. It can be easy to lose sight of all the possibilities. In this talk, the speaker will explain how choosing and implementing appropriate procedures need not be unnecessarily complicated and how the perfect material application can be achieved in just a few steps.
Since the number of participants will nevertheless be restricted due to the ongoing coronavirus regulations, the presentations will also be offered in a streaming version. Interested persons can thus decide whether they wish to attend in person or listen to the sessions that interest them online.
Following the forced cancellation of the event in 2020, "Wir gehen in die Tiefe" will run from September 21-23, 2021 at the Penta Hotel, Leipzig. By using the partner code rehm21IFD, interested parties can participate in the EPP InnovationsFORUM free of charge. Registration for the event is online and is available at https://epp.industrie.de/innovationsforum-deutschland-2021/.
Registration for "Wir gehen in die Tiefe" is available at https://www.wir-gehen-in-die-tiefe.eu/home-page/anmeldung/.
Share on:
Suggested Items
Molex Releases New Report on Strategies for Advancing Rugged, Reliable Connectivity in Modern Aerospace and Defense Applications
04/01/2025 | MolexMolex, a global electronics leader and connectivity innovator, has released a new report from AirBorn, a Molex company, which explores the unrelenting demands for constant, continuous connectivity to support the rigors of modern aerospace, defense and space-industry applications.
Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
04/01/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
Airbus to Design and Build ESA’s ExoMars Rover Lander Platform
03/31/2025 | AirbusAirbus has been selected by the European Space Agency (ESA) and Thales Alenia Space (TAS - a joint venture between Thales (67%) and Leonardo (33%)), the ExoMars industrial prime contractor, to build key systems for the ExoMars lander that will safely place the Rosalind Franklin rover on the surface of the Red Planet.
New Cryostatic Systems Elevate Current Research on Qubits
03/31/2025 | Fraunhofer IAFThe Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.
The Knowledge Base: At the Forefront of Electronics Manufacturing
03/26/2025 | Mike Konrad -- Column: The Knowledge BaseThe electronics manufacturing industry is at a transformative crossroads, shaped by emerging technologies, shifting supply chain dynamics, sustainability initiatives, and the relentless push for miniaturization and efficiency. The industry's future will be defined by innovations in semiconductor manufacturing, automation, artificial intelligence (AI), and sustainable practices. Here, I will explore the key developments that are propelling the industry forward and their implications for manufacturers, engineers, and stakeholders.