Schweizer Achieves Successful IATF Certification of the Jintan Plant
July 19, 2021 | Schweizer Electronic AGEstimated reading time: 1 minute

More than a year ago, production was launched at SCHWEIZER’s new high-tech plant in Jintan (China). Another important milestone for the plant in China, but also for the global orientation of the company, has now been achieved with successful IATF 16949:2016 certification.
After SCHWEIZER had already passed the ISO 9001 certification last year, numerous customer audits of European and Asian automotive customers in accordance with VDA 6.3 were successfully carried out in 2020/2021. The IATF 16949:2016 certification received by the Jintan plant (China) is of great importance for qualification as a supplier in the automotive market, and the SCHWEIZER plant is now fully qualified for the requirements of the automotive segment.
"Thanks to the completed IATF certification, Jintan is now also able to work with the major automotive partners and fully meet all the important quality requirements. This is a milestone for China and Germany, both in terms of the collaboration with existing customers and in terms of new customers and partners. This is an important step that we have now achieved for SCHWEIZER’s success and acceptance on the global market," says Billy Liu, Quality Manager in Jintan (China).
At its site in Germany, SCHWEIZER has been able to successfully maintain important certifications such as the IATF 16949:2016 and ISO 9001 and other key quality standards for years. By linking the European PCB production factory in Schramberg, Germany, and the new plant in China, the highest level of delivery security for the supply chain stability of customers in Europe and Asia can be ensured. With its Chinese location, SCHWEIZER is opening up access to new markets and customer groups and is able to provide a complete range of PCB technologies, ranging from simple multilayer circuit boards to future-oriented chip embedding technology from both production plants.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Cicor Posts Strong Order Intake in a Continued Challenging Environment
10/15/2025 | CicorThe Cicor Group continued its growth path during the third quarter of 2025. Quarterly sales increased by 33% to CHF 160.1 million (YTD: CHF 440.8 million, an increase of 25.4%).
Episode 6 of On the Line with... Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.