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Advanced Electronics Packaging Digest

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Global Tier-1 YFORE Launches U.S. Manufacturing Factory in Atlanta

08/28/2026 | PRNewswire
YFORE officially inaugurated its new 62,225 sq. ft. American Headquarters in Suwanee, Georgia. Integrating R&D, manufacturing, procurement, sales, and delivery, the facility brings agile engineering and resilient local supply chains directly to local automotive partners.

Renesas Opens Physical AI & Robotics Lab in Beijing

08/27/2026 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the official opening of its Physical AI & Robotics Lab in Beijing, China.

Lockheed Martin, Verizon and Partners Demonstrate Airspace Protection Tech

08/17/2026 | PRNewswire
Lockheed Martin, in collaboration with Verizon, NVIDIA, Keysight Technologies, ODC and Astris AI, recently showcased how commercial off-the-shelf (COTS) technologies can make detecting and tracking unmanned aircraft systems (UAS) more accessible, faster to deploy, and easier to scale for public and critical infrastructure protection.

LG Innotek Partners with TDK to Develop Solutions for Physical AI

07/28/2026 | PRNewswire
LG Innotek announced that the company has aligned on a strategic partnership in the field of physical AI with TDK Corporation, a global electronics company (President and CEO Noboru Saito).

Smart Eye Secures Additional Interior Sensing Order with Major Global OEM

07/20/2026 | Smart Eye
Smart Eye, a leading developer of Driver Monitoring System (DMS) and interior sensing software for the automotive industry, has secured an additional order from a major Global OEM.
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