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Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

12/13/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $225 million in proposed direct funding under the CHIPS and Science Act.

Bosch in Japan: New Headquarters and Innovation Center

09/17/2024 | Bosch
Bosch has reaffirmed its commitment to Japan with a total investment of 270 million euros in a new headquarters in Yokohama. A state-of-the-art new Japanese headquarters brings under one roof development capacity for the mobility sector that was spread across several locations.

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

04/10/2024 | IPC
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024.

Quantum Technologies: Bosch Aims to Use Sensors to Take a Leading Position

10/05/2023 | Embedded PR
Quantum technologies have great potential, but most of this potential is still a distant dream at present.

TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

08/08/2023 | Business Wire
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services.
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