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Advanced Electronics Packaging Digest

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Kymeta Joins Red Cat Initiative for Maritime Connectivity

05/15/2026 | Globe Newswire
Red Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.

memsstar’s ORBIS Alpha Etch System Installed in TUM Quantum Networks Lab

03/30/2026 | Globe Newswire
memsstar Ltd., a leading provider of etch and deposition equipment to researchers and manufacturers of semiconductors and micro-electromechanical systems (MEMS), announced the installation and characterisation of its ORBIS™ Alpha Xeric Oxide Etch system at the Garching, Germany, campus of the Technical University of Munich (TUM).

Atom Computing Announces Strategic Collaboration with Cisco

03/26/2026 | PRNewswire
Atom Computing announced the signing of a Memorandum of Understanding (MOU) with Cisco to explore how neutral-atom quantum computers can be linked together through quantum networks to enable distributed quantum computing architectures.

Ericsson, Intel Collaborate to Accelerate the Path to Commercial AI-native 6G

03/02/2026 | Intel Corporation
Ericsson and Intel are pooling their next-generation technology leadership to help accelerate ecosystem readiness for seamless transition to AI-native 6G deployments and use cases.

NTT Unveils Technology to Enhance AI Performance for 6G and Next Generation Computing

03/02/2026 | BUSINESS WIRE
NTT, Inc., NTT DOCOMO, Inc., and NTT DATA Group Corporation announced that they will exhibit at MWC Barcelona 2026, the world's largest connectivity exhibition, in Barcelona, Spain, from March 2 to 5.
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