-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Altium, IPC Education Foundation, and Arduino Announce Student Electronics Design Competition
August 17, 2021 | Altium LimitedEstimated reading time: 2 minutes
Altium LLC, the leading printed circuit board (PCB) software company, is partnering with the IPC Education Foundation (IPCEF) and Arduino to launch the first student electronics design challenge to engage, educate, and enhance printed circuit board (PCB) design capabilities while developing STEM solutions to environmental challenges.
The Innovation for Environmental Change 2021 International Student Design Competition (#PCBeTheChange) engages student teams to help address common environmental concerns using Altium’s educational tools with Arduino hardware.
Teams from high schools and colleges will be using Altium’s Upverter Modular PCB design software and the Arduino Portenta H7 to create a prototype design that will improve the environment in each team’s respective local area. The teams will be challenged to tackle one or more environmental concerns, such as air pollution, water quality and solar energy capture.
As Lotte Nørregaard Andersen, Head of Arduino Education, elaborates, "At Arduino, we believe that it is very crucial to empower scientists of the future to address common challenges of our time using technology. We’re delighted to partner with Altium LLC and the IPC Education Foundation in the Innovation for Environmental Change 2021 International Student Design Competition; this competition really aligns with our goal of creating the next generation of STEM solutions."
Participating teams can enter the design challenge while harnessing Altium’s Upverter Education training modules plus the Upverter Modular tool. Altium features multiple educational initiatives designed to support high school STEM teachers and students, along with programs to support college students and industry professionals.
“Students learning electronics design can get a comprehensive overview of how to design their own hardware with guided training in easy-to-understand modules. We’re honored to support the next generation of electronics designers by providing the curriculum and tools students need for the contest,” adds Rea Callender, Vice President of Upverter Education.
Winning teams will be eligible to win cash prizes for each category: high school and college: $1500 (1st prize), $750 (2nd prize) and $500 (3rd prize), free access to IPC APEX EXPO in San Diego, CA from January 25-27, 2022 as well as virtual access to AltiumLive 2022 CONNECT, co-located alongside the IPC APEX EXPO at the San Diego Convention Center. Designs will be featured on display at the IPC Design Booth; awards will be presented at the IPC APEX EXPO STEM Outreach Event.
Charlene Gunter, Senior Director of IPCEF shares, “We believe that opportunities and experiences like this will allow students to gain awareness and access to the electronics manufacturing industry and in turn help them reach their career goals. This collaborative partnership with Altium, Upverter Education, and Arduino showcases our mutual goals of engaging and educating students in PCB design, and we look forward to seeing the creativity and solutions the teams will create.”
Open registration is available via Upverter Education for the design challenge beginning on Monday, August 16th and runs through Friday, October 1st; team designs must be received online by Friday, November 19th. Competition winners will be announced on Friday, December 17th, followed by virtual presentations for the first place, and runner-up entrants.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.