The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
It’s Only Common Sense: Why Failure Is an Opportunity for Growth
PAC INNOVATION RADAR Names Siemens “Best in Class” in Open Digital Platforms
September 17, 2021 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software announced today that it has been named “Best in Class” in PAC INNOVATION RADAR’s vendor analysis report, the Open Digital Platforms for Cloud-centric Industrial IoT in Europe, 2021. The report provides a graphical representation and written analysis of the positioning of various digital platform providers for cloud-centric industrial Internet of Things (IoT) and is conducted on the basis of an analytical assessment of criteria which PAC, a Teknowlogy Group Company, previously defined for this analysis. With this, Siemens has been “Best in Class” for 3 years consecutively.
Siemens was selected to be the “Best in Class,” along with only one other vendor out of the total 11 vendors evaluated and assessed on relative market strength and competence using a wide-ranging set of criteria. Siemens scored significantly higher than average in several of these criteria including unique selling proposition, the strategic activities in the last twelve months, platform capabilities, ecosystem leadership, complementary services & service quality, client bases and relationships in Europe, expansion of go-to-market, expansion of use cases and applications, market perception, ability to grow, etc.
“Siemens is fully embracing the cloud and the app store model, which actually is a real app store and not just a catalog,” says Arnold Vogt, Head of Digital Innovation & IoT, at PAC. “The strength of MindSphere from Siemens, that made them a “Best in Class”, lies in four aspects – the strong installed base; the integration of MindSphere within the Siemens portfolio, including the Industrial Edge and the acquired low-code application development platform, Mendix; the strong Siemens partner ecosystem; and the MindSphere store.”
MindSphere®, the industrial IoT as a service solution from Siemens, was developed by Siemens for applications in the context of the Internet of Things. MindSphere stores operational data and makes it accessible through digital applications to allow industrial customers to make decisions based on valuable information.
“Our customers want to turn the power of data, advanced analytics and integrated automation into sustainable innovation,” says Ray Kok, Senior Vice President of Cloud Application Services for Siemens Digital Industries Software. “In combination with Industrial Edge, MindSphere provides ready-to-use cloud and edge computing solutions with advanced analytics and AI, integrated with our leading low-code application development platform, Mendix. The combination of IIoT for edge, cloud and low-code boosts the operational efficiency of our customers multiple folds and hence we are very well positioned to serve the needs of our customers. We are extremely pleased that for the third year in a row, PAC RADAR has placed Siemens MindSphere in the “Best in Class” category in their Cloud-centric Industrial IoT Platforms report.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Lockheed Martin Sikorsky Awarded Army Contract for Black Hawk® Modernization Efforts
08/21/2025 | Lockheed MartinSikorsky, a Lockheed Martin company announced a new U.S. Army contract that will fund Black Hawk® modernization engineering efforts.
Ta Yang Group Holdings Limited Announcing AI Transformation Blueprint
08/21/2025 | ACN NewswireTa Yang Group Holdings Limited, a well-established Hong Kong-listed company with nearly two decades of market presence, plans to further advance comprehensively into the Web 4.0 field and artificial intelligence (AI) industry.
SEMI MEMS, Sensors NextGen Congress 2025 to Explore the Future of Sensing Technology
08/15/2025 | SEMIMEMS and Sensors NextGen Congress (MSNG) 2025, the premier technical event on sensor innovation, will bring together leaders from across the MEMS and sensors ecosystem from September 16-18 at the SEMI headquarters in Milpitas, Calif. Registration is open.
Siemens Empowers Europe’s Next Generation of Semiconductor Innovators with Open Higher Education Program
08/13/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced today the Cre8Ventures Open Higher Education Program, an ambitious new initiative developed in collaboration with Arm and the University of Southampton’s School of Electronics and Computer Science (ECS), to foster entrepreneurial curiosity and accelerate student-led semiconductor innovation across Europe’s leading technical universities.
A Plan for Floor Planning: Design007 Magazine August 2025
08/08/2025 | I-Connect007 Editorial TeamFloor planning is full of potential pitfalls—but don’t worry. This month’s contributors share best practices and actionable strategies to help you avoid that dreaded 5:30 p.m. Friday call from the fabricator. Engineers have to weigh dozens (sometimes hundreds) of tradeoffs to balance electrical performance with physical and cost constraints. The decisions made here ripple through the rest of the project: stackup choices can come back to haunt you, and component placement can impact signal integrity, routing efficiency, and overall manufacturability. And as pitch shrinks, the margin for error disappears.