Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India

08/20/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.

OKI Develops Tiling Crystal Film Bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

08/15/2025 | BUSINESS WIRE
OKI has successfully developed Tiling crystal film bonding technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology.

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India

08/14/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.

Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium

08/12/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025.

TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025

08/11/2025 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in