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Advanced Electronics Packaging Digest

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Compal, ARC Cloud Forge Strategic Partnership to Accelerate Large-Scale AI Infrastructure

10/27/2026 | PRNewswire
Compal Electronics, Inc. and ARC Cloud announced the signing of a Memorandum of Understanding (MOU) to advance their strategic collaboration in large-scale AI computing infrastructure.

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

Flex Acquires EPC Power to Expand AI Data Center Power Solutions

10/14/2026 | Flex
Flex announced that it has completed its acquisition of EPC Power, a leading provider of intelligent power conversion solutions for data center and grid applications.

IC-Link by imec Expands TSMC Collaboration for Advanced-Node Chip Design

10/01/2026 | Imec
IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities.

Zhen Ding Prices $800M Overseas Convertible Bonds

09/24/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited successfully priced its sixth unsecured overseas convertible bonds issuance on September 22, 2026, raising a total of US$800 million (approximately NT$25.2 billion).
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