Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
June 13, 2025 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Customers will be able to accelerate the development of their industrial technology by leveraging Cadence’s industry-leading solutions, optimized for NVIDIA Grace Blackwell platforms. These innovative solutions include the Fidelity™ CFD Platform, the Spectre® X Simulator, the Voltus™ IC Power Integrity Solution, and the Innovus™ Implementation System, among others.
Europe’s industrial AI ecosystem will be able to leverage Cadence® solvers accelerated by NVIDIA Blackwell systems by up to 80X from the industrial AI cloud. Ascendance is using Cadence Fidelity computational fluid dynamics software and NVIDIA accelerated computing to design the future of aviation, achieving a 20X reduction in simulation runtimes.
In addition, the AI cloud will be built using the NVIDIA Omniverse Blueprint for AI factory design and operations, which leverages the Cadence Reality™ Digital Twin Platform to simulate and optimize the entire operation in a physically accurate virtual environment, enabling engineering teams to build smarter, more reliable facilities. This approach further ensures performance-driven data center design and drives peak operational efficiency.
“Cadence’s solutions, combined with NVIDIA AI infrastructure, are transforming the future of engineering design for the European ecosystem,” said Michael Jackson, corporate vice president and general manager of the System Design and Analysis Group at Cadence. “By making our solutions available on the NVIDIA industrial AI cloud, we’re empowering Europe’s leaders to design intelligent systems faster and with higher quality than ever before."
“The ability to simulate the physical world with extraordinary fidelity and speed is transforming engineering and design,” said Tim Costa, senior director, CUDA-X and CAE at NVIDIA. “With Cadence tools running on the world’s first industrial AI cloud, Europe’s engineers can invent, test and refine the future before it's built.”
Built on 10,000 NVIDIA Blackwell GPUs in NVIDIA DGX B200 systems and NVIDIA RTX Pro Servers, and running NVIDIA CUDA-X, and NVIDIA Omniverse accelerated workloads, this new AI cloud enables Europe’s industrial leaders to leverage Cadence solutions, accelerating applications for semiconductor and system design end markets, including automotive, energy infrastructure and manufacturing.
Cadence recently announced that it is transforming AI-accelerated simulation for multiple markets, including industrial AI, with its new Cadence Millennium™ M2000 Supercomputer. The Millennium M2000 Supercomputer combines industry-leading design software from Cadence and NVIDIA CUDA-X libraries with the NVIDIA Blackwell platform, including the NVIDIA GB200 NVL72 systems, to accelerate silicon, system and drug design.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.