Mycronic’s Global Technologies Divests AEi
September 30, 2021 | MycronicEstimated reading time: 1 minute
Mycronic’s Global Technologies division has divested Automation Engineering, Inc. (AEi) to Singapore-based ASM Pacific Technology.
AEi, which was acquired by Mycronic in 2016, develops, manufactures, and sells innovative and market leading solutions for precision Camera Module Assembly and Test (CMAT) systems used in electronics products. AEi provides a comprehensive product portfolio of fully-automated active alignment solutions, used to assemble camera modules and to measure and verify quality during volume production. The equipment is modular and adapted to customer requirements. The largest customer segment is the automotive industry.
“Our goal has been to find an owner with an existing broad offering towards the automotive industry, who in addition has a technological leadership position in active alignment solutions for camera and sensor assembly and thus can leverage AEi’s technology and know-how. We believe we have found such an owner in ASM Pacific Technology,” says Michael Chalsen, Sr VP Global Technologies at Mycronic.
“We greatly look forward to continuing to develop AEi’s global market and technology leadership position together with ASM Pacific Technology and enabling full line solutions for the automotive and adjacent markets,” says Jean Marc Peallat, General Manager, AEi.
The transaction is expected to be finalized in the fourth quarter of 2021 or first quarter of 2022, subject to customary closing conditions and regulatory approvals.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
AT&S Plans Entry Into the Defense Sector
10/02/2025 | AT&SIn times of global uncertainty and geopolitical tension, AT&S is expanding its portfolio to include the defense sector. As a globally leading provider of high-end IC substrates and printed circuit boards, the company is responding to growing demand for security-relevant solutions and emphasizing its social responsibility. This demand will be addressed from its site in Leoben, Austria.