-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
University of Bayreuth Uses New LPKF ProtoLaser R4
October 5, 2021 | LPKFEstimated reading time: 3 minutes
Researchers in engineering sciences at the University of Bayreuth now have a unique laser device equipped with an ultrashort-pulse laser source for material processing available to them. In the fields of gas sensor technology, high-frequency technology, and microsystems technology, the device opens up unimagined research possibilities. It can structure layers and coatings on sensitive surfaces with great precision. Hardened or fired technical substrates of all kinds can be precisely cut. The German Research Foundation (DFG) provided 50 percent of the funding for the purchase of the device for the Functional Materials research group.
The laser system is able to generate ultrashort laser pulses that last 1.5 picoseconds – not much longer than a trillionth of a second. As a result, almost no heat transfer occurs during material processing with this laser: the material hit by the laser beam with utmost accuracy evaporates immediately. Consequently, it is all the easier to structure and engrave surfaces at the micrometer level in a controlled manner without damaging adjacent areas. Other examples are the removal of transparent and extremely thin layers from the substrate or the detachment of metal layers from plastic films. Precise cutting and milling of ceramic materials such as aluminum oxide are also possible.
“The new laser processing system is invaluable for the research and development of innovative functional materials, for example, of highly sensitive sensors or extremely finely structured printed circuit boards. On the campus of the University of Bayreuth, it will be accessible to all natural and applied sciences research areas, as well as to external research partners. The device will also enable young scientists to work on research topics for which the necessary infrastructure is lacking at many other university locations,” says Prof. Dr.-Ing. Ralf Moos, Chair of Functional Materials. “We already received a number of inquiries that led to very interesting research work over the last few years with our predecessor system. I am sure that we will receive just as many requests with our new laser processing system and become involved in exciting new challenges,” says Dr.-Ing. Jaroslaw Kita, who supervises the device at Functional Materials.
The laser system is available to researchers for processing a wide range of materials.
The LPKF ProtoLaser R4 was developed especially for use in research on different materials. The system has a 515 nm picosecond laser source with a galvanometer scanner and is standardly equipped with a fiducial alignment camera, an X/Y/Z vacuum table, and the LPKF CircuitPro PL software.
Structuring of layers and coatings is already well tested. With a focus spot size of 15 ?m, the beam can structure traces with widths down to 1 mil (25 ?m) and spacings down to 15 ?m. On thin-film ceramics and on glass, a resolution of 10 ?m may even be possible, depending on the metal thickness and the peel strength.
The laser can be used for structuring and engraving a multitude of different materials, including Si, SiN, CoFe, GaN, FR4, Taconic, CuFLON®/PTFE, Al2O3, and LTCC. Engraving with depth control is possible for metals such as copper, nickel, brass, tungsten, and others as well as for plastics such as polyimide/Kapton and many more.
The material processing performed by the ProtoLaser R4 also includes drilling and cutting diverse materials: Borofloat and Schott glass, Si, SiN, CoFe, and GaN; FR4, Rogers, Taconic, Panasonic, CuFlon® / pure PTFE, Al2O3, LTCC, polyimide/Kapton, and other materials used in electrical engineering; and metals such as gold, copper, nickel, platinum, brass, and tungsten.
All of this makes the laser machine an all-around talent for research with a wide range of materials. The Chair of Functional Materials at the University of Bayreuth is already excited about the numerous innovative developments that will be made with his new laser system.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
LPKF Gets Off to a Solid Start in 2026
05/04/2026 | LPKFLPKF Laser & Electronics SE has made a solid start to the 2026 financial year despite a macroeconomic environment that remains challenging.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
AI, HDI, and Interconnect Optimization with MKS' ESI
04/23/2026 | Real Time with... APEX EXPOThis discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.
Horizon Sales Adds LPKF Laser and Electronics to Its Lineup
04/21/2026 | Horizon SalesHorizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, is pleased to announce a new partnership with LPKF Laser and Electronics, a global leader in precision laser technology
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.