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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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New Podcast Series Launches: Optimize the Interconnect
July 10, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is excited to announce the debut of Optimize the InterconnectSM—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
In the premiere two-part episode, “What is OTI?,” Ryder breaks down the foundational ideas behind the Optimize the Interconnect (OTI) approach. This unified strategy brings together laser processing, surface treatment, and plating chemistry to improve via reliability, performance, and production efficiency.
This series complements the just-released companion guide, which offers engineering teams a technical deep dive into unified via formation and real-world case studies demonstrating the benefits of OTI.
- Listen to the first episode here.
- Read the companion guide here.
Stay tuned! This is the start of an essential conversation around more innovative, faster, and more integrated interconnect solutions.
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