Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
AIM Solder Brings New Low-Voiding, No Clean Solder Paste to Productronica
October 11, 2021 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that they will feature their new low-voiding, no clean paste along with their full line of solder assembly materials at Productronica, scheduled to take place on November 16th-19th, 2021 at Messe München in Munich, Germany.
The company will launch its newly developed solder paste engineered to solve one of the industry’s most difficult challenges for BGA and BTC packages. AIM studies show that solder joint reliability and thermal dissipation concerns are significantly reduced with its new no clean paste. Be sure to follow AIM on social media for more news on this exciting new development.
AIM will also highlight its REL22™ and REL61™ alloys and NC273LT low temperature solder paste. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement. AIM’s REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61 is ideally suited for industries which require a cost-effective alternative to SAC305 with no loss of processing performance or durability.
To discover all of AIM’s products and services, visit us at Productronica in Hall A4 Stand 420 for more information and to speak with one of AIM’s knowledgeable staff members.
Share on:
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.