Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

DENSO Invests in Next Core Technologies to Enhance Performance of Electric Vehicles

03/20/2026 | JCN Newswire
DENSO CORPORATION announced it has invested in Next Core Technologies, Inc. with the aim of jointly developing in the field of motor cores.

DENSO Signs Joint Development Agreement with MediaTek for Automotive SoC

12/30/2025 | JCN Newswire
DENSO CORPORATION announced that on October 31, 2025, it signed a joint development agreement with MediaTek Inc., a leading semiconductor design company, to accelerate the development of next-generation automotive system-on-chips (SoCs).

DENSO Collaborates with AT&T to Improve Road Safety Technology

08/27/2025 | PRNewswire
DENSO Products and Services Americas, Inc., an affiliate of leading mobility supplier DENSO and AT&T Connected Solutions are working together to help deliver to both cities and the automotive industry with a customizable portfolio of services and AT&T-certified hardware and software to enable safer and more efficient driving experience for the traveling public.

DENSO, onsemi Collaborate for a Strengthened Relationship

12/17/2024 | JCN Newswire
DENSO CORPORATION and onsemi announced today that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced driver assistance systems (ADAS) technologies.

DENSO, U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)

10/29/2024 | JCN Newswire
DENSO CORPORATION and Quadric.inc have signed a development license agreement for a Neural Processing Unit (NPU)(1), which is a semiconductor specialized for the arithmetic processing of AI.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in